Heat dissipation device

Abstract

The invention relates to a heat dissipation device. The heat dissipation device includes a shell and a heat pipe; the shell comprises a chamber which accommodates a working fluid; a plurality of supporting columns and a plurality of fixing elements are arranged in the chamber; the heat pipe comprises a heat absorption area arranged in the chamber of the shell and is fixed by the plurality of fixing elements; a heat dissipation area extends from the heat absorption area and passes through the shell, and is arranged at the exterior of the chamber of the shell.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device of a uniform temperature plate and a heat pipe. Background technique [0002] As the current electronic equipment is gradually advertised as light and thin, the size of each component must be reduced accordingly. However, the heat generated by the reduction in the size of electronic equipment has become a major obstacle to the improvement of the performance of electronic equipment and systems. Therefore, in order to effectively solve the heat dissipation problem of components in electronic equipment, the industry proposes vapor chambers and heat pipes with better heat conduction performance to effectively solve the current heat dissipation problem. [0003] The vapor chamber (Vapor chamber includes a rectangular shell and the capillary structure of the inner chamber wall of the shell, and the inside of the shell is filled with working liquid, and one side of ...

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Problems solved by technology

[0006] Furthermore, although the existing vapor chamber can achieve the effect of uniform temperature, another problem has been extended, that is, the heat transfer method of the vapor chamber is that after one side of the vapor chamber absorbs heat, it is absorbed by the vapor of the working liquid in the chamber. The liquid phase change conducts to the other side, in other words, the vapor chamber only absorbs heat from one side and conducts it to the opposite side to achieve a uniform temperature effect, but it cannot have the same heat transfer method as a heat pipe. The absorbed heat is conducted to the remote end for heat dissipation. Therefore, the vapor chamber is only suitable for large-area uniform heat conduction, and is not suitable for remote heat conduction.

If the heat cannot be dissipated in a timely manner, it is easy to accumulate heat near the heat source

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