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Epoxy resin composition, use thereof, and filler for epoxy resin composition

A technology of epoxy resin and inorganic filler, applied in the direction of epoxy resin glue, dyed organic silicon compound treatment, adhesive type, etc., can solve research and other problems, and achieve the effect of excellent formability and excellent combustion resistance

Active Publication Date: 2021-06-01
UBE IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the usual (compound-type) silane coupling agents have not necessarily been studied in detail

Method used

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  • Epoxy resin composition, use thereof, and filler for epoxy resin composition
  • Epoxy resin composition, use thereof, and filler for epoxy resin composition
  • Epoxy resin composition, use thereof, and filler for epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0062] Hereinafter, although an Example and a comparative example demonstrate this invention more concretely, this invention is not limited to these Examples.

[0063] The kneading procedure at the time of preparing an epoxy resin composition was evaluated by the following method.

[0064] (1) mixing

[0065] Knead a specific amount of epoxy resin, phenol resin as a hardener, magnesium oxide powder and silica powder as a filler at a specific temperature using a twin-shaft kneader. The kneaded product discharged from the discharge port was evaluated. As evaluation criteria, ○: kneading was possible without any problem, △: kneading was possible but the kneaded product was not uniform, ×: kneading was not possible.

[0066] In addition, the epoxy resin composition was evaluated by the following method. Moreover, the epoxy resin composition powder was formed into an ingot, and this ingot was used as a sample and evaluated. The ingot was molded by hand pressing at a pressure of...

Embodiment 2

[0115] As shown in Table 1, an epoxy resin composition was obtained in the same manner as in Comparative Example 5, using Hardener 2 (biphenyl aralkyl type phenol resin) instead of Hardener 1 (phenol formaldehyde type phenol resin) as a hardener. of mixes. In addition, its evaluation is performed.

Embodiment 3

[0117] As shown in Table 1, magnesium oxide powder 2 whose surface has been treated with N-2-aminoethyl-3-aminopropyltrimethoxysilane is used instead of magnesium oxide powder 1, and epoxy resin is obtained in the same manner as in Example 2. A kneaded product of a resin composition. In addition, its evaluation is performed.

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PUM

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Abstract

The invention discloses an epoxy resin composition, its application and a filling material for the epoxy resin composition. Specifically, the present invention can provide a thermally conductive epoxy resin composition containing magnesium oxide powder that can be easily prepared by kneading, has improved fluidity, has excellent formability, and has good water absorption (low water absorption). The epoxy resin composition of the present invention is characterized in that it contains an epoxy resin, a curing agent, and magnesium oxide powder surface-treated with an alkoxysilane having at least one of a phenyl group and an amino group. In addition, the present invention can provide a thermally conductive epoxy resin composition containing magnesium oxide powder, which is preferably further excellent in combustion resistance. The epoxy resin composition of the present invention can be suitably used as a thermally conductive sealing material, a thermally conductive sheet, a thermally conductive adhesive, and a cured product.

Description

technical field [0001] The present invention relates to a thermally conductive epoxy resin composition containing magnesium oxide powder, a thermally conductive sealing material, a thermally conductive sheet, a thermally conductive adhesive, a cured product, and a thermally conductive epoxy resin composition containing Magnesium oxide powder filler for epoxy resin compositions. In particular, it relates to a thermally conductive epoxy resin composition that can be easily prepared by kneading, has improved fluidity, has excellent moldability, has good water absorption (low water absorption), and preferably further has excellent combustion resistance. Background technique [0002] Epoxy resin compositions are used for various purposes in numerous fields. [0003] Especially in electronic parts, it is suitably used as a substrate material, a sealing material, a thermally conductive sheet material, an adhesive, and the like. In this application, the amount of heat released fro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/22C08G59/40C09J163/00C09J11/04C08J5/18C09C1/02C09C3/12
CPCC08G59/621C08K3/22C08K5/5415C08K9/06C08K2003/222C08L63/00C09J163/00C09K3/10C09K5/14H01L21/56H01L23/29H01L23/31H01L23/373
Inventor 藤永匡敏篠田教一中江胜西田直人山口诚治
Owner UBE IND LTD
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