Method for adhering structures by adhesive in electronic device

A technology of electronic equipment and adhesives, applied in the direction of adhesive heating bonding methods, bonding methods, adhesives, etc., can solve problems such as artificial traces

Inactive Publication Date: 2015-03-25
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Curing operations have a tendency to shrink liquid adhesives, which can cause problems with undesired visible artifacts on the bonded layers

Method used

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  • Method for adhering structures by adhesive in electronic device
  • Method for adhering structures by adhesive in electronic device
  • Method for adhering structures by adhesive in electronic device

Examples

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Embodiment Construction

[0016] Electronic devices may include structures that are bonded together using adhesives. The structures being bonded together may include layers in a display module, display cover glass layers, touch sensor layers, layers of other planar materials, electronic components, mounting brackets, housing structures, and other electronic device structures. Configurations in which display components, such as liquid crystal display layers, organic light emitting diode display layers, touch sensor layers, and other display layers, are bonded together are sometimes described herein as examples. However, this is only illustrative. Any suitable structures may be bonded together with adhesives, if desired.

[0017] An illustrative electronic device that may be provided with a display and other structures bonded using an adhesive is in figure 1 , 2 , 3 and 4 are shown.

[0018] figure 1 The illustrative electronic device 10 has the shape of a laptop computer having an upper housing 12A...

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Abstract

An electronic device may include a display layer and other structures. A layer of liquid adhesive can be patterned on the structures. The liquid adhesive can be pre-solidified to increase viscidity of the liquid adhesive and partially shrink the liquid adhesive. The structure applied with the liquid adhesive can be laminated to another structure. During the lamination process, the pre-solidified liquid adhesive can be compressed between the laminated structures. Then the liquid adhesive can be completely solidified to adhere the structures. Thickening of the liquid adhesive during the pre-solidifying process facilitates dispersion of the adhesive. Shrinkage of the liquid adhesive facilitates the stress that generates visible artifact of stress introduction after solidification.

Description

[0001] This application claims priority to U.S. Patent Application No. 14 / 538,221, filed November 11, 2014, and U.S. Provisional Patent Application No. 62 / 602,659, filed October 10, 2014, both of which are hereby Incorporated herein by reference in its entirety. technical field [0002] This document relates generally to electronic devices and, more particularly, to bonding electronic device structures with adhesives. Background technique [0003] Electronic devices often include components that are bonded together using adhesives. For example, a display may have layers laminated together using a liquid adhesive. The challenge is to form bonds using liquid adhesives. If the adhesive is too viscous, it is difficult to adequately disperse the adhesive during lamination. If the adhesive is too thin, it may be difficult or impossible to adequately control the shape of the adhesive boundary when those layers are pressed together. Curing operations have a tendency to shrink th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00C09J5/06
Inventor C·Y·刘林德松孙国华
Owner APPLE INC
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