Function automation testing system and testing method based on SoPC chip

A technology of automated testing and functions, applied in the direction of electronic circuit testing, etc., can solve the problems of complex test system construction, increased test difficulty and operation complexity, and long time

Active Publication Date: 2015-03-25
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This test method usually writes the entire test system as a whole, and compiles the test program according to the function to be tested, and each compilation takes a lot of time
[0004] To sum up, when the traditional test method tests different functions of the same SoPC chip, the test system is complex to build, takes a long time, has poor reusability, and is difficult to maintain, which increases the difficulty of testing and operational complexity

Method used

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  • Function automation testing system and testing method based on SoPC chip
  • Function automation testing system and testing method based on SoPC chip
  • Function automation testing system and testing method based on SoPC chip

Examples

Experimental program
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Embodiment

[0186] In this embodiment, an automatic functional test is carried out for a SoPC chip including a SPARC V8 core processor, 1MB SRAM, 8MB FLASH, 16MB SDRAM and 300,000 FPGAs.

[0187] In the automated test system, the serial communication interface test module includes the test circuits of 4 asynchronous serial communication interfaces; 2 The C test module includes 2 I 2 C test circuit; the interrupt processing test module includes test circuits for 1 non-maskable interrupt and 4 external interrupts; the timer test module includes test circuits for 3 application modes output by 10 timers, and the three application modes are respectively Internal clock mode, external clock mode and external real start mode; counter test module includes 12-way counter test circuit; bus test module includes 1-way high-speed 1553B bus test circuit; analog switch / ADC test module includes 4-way 7-bit analog switch input and 4 independent ADC test circuits; the GPIO test module includes a test circu...

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Abstract

The invention provides a function automation testing system and testing method based on a SoPC chip. The system comprises a serial communication interface testing module, an I2C testing module, an interrupt processing testing module, a timer testing module, a counter testing module, a bus testing module, an analogue switch/ADC testing module, a GPIO testing module, an FPGA configuration module, a communication module and a testing control module. According to the automation testing method, in the same testing system, all function modules of the SoPC chip are tested in the same testing program according to testing needs, the situation that return of all testing projects is compiled when different functions of the same SoPC chip are tested through a traditional testing method is avoided, testing time can be effectively shortened, and testing difficulty and testing operation complexity are lowered.

Description

technical field [0001] The invention relates to the field of SoPC (System-on-Programmable-Chip) chips, in particular to a SoPC chip-based functional test system and a test method thereof, which realize hardware function screening before chip storage and hardware function confirmation before delivery. Background technique [0002] With the development of microelectronics technology, computer technology and EDA technology, and the increasing demand for miniaturization, flexibility and low power consumption of electronic control systems of weapons and space vehicles, SoPC technology has emerged. SoPC is the integration of SoC and FPGA technology, finding a compromise between ASIC and programmable logic device, it integrates system design such as processor, memory, FPGA and peripheral interface into one chip as needed, and replaces it with one chip It replaces the traditional electronic system, realizes the miniaturization, light weight, high integration, low power consumption, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 王蕊兰利东赵元富周华章陆振林舒磊刘薇李璟李楠
Owner BEIJING MXTRONICS CORP
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