Production method of bonding area silver paste protection structure
A technology for protecting structure and binding area, applied in the input/output process of data processing, instruments, electrical digital data processing, etc., can solve the problems of silver paste damage, poor adhesion of silver paste transparent conductive film, air oxidation, etc. To achieve the effect of reducing damage or falling off, solving damage and being oxidized by air
Inactive Publication Date: 2015-03-25
CHONGQING GRAPHENE TECH +1
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Problems solved by technology
[0002] At present, silver paste is widely used in electronic products such as touch screens. However, during the manufacturing process, since the silver paste is exposed, it is necessary to solve the problems of avoiding silver paste damage and being oxidized by air, especially for printing on carbon nanotubes and metal grids. The silver paste on the surface of the binding area on materials such as silver nanowires, graphene, etc., due to the poor adhesion of the silver paste on this type of transparent conductive film, the risk of being damaged or falling off due to external force is greater
In response to the above problems, the general measure is to print insulating ink on the silver paste traces for protection, but because the silver paste in the bonding area needs to be in contact with the FPC gold fingers, it cannot be protected with insulating ink, and it is still exposed.
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[0016] figure 1 It is a schematic structural view of the protective structure of the silver paste in the binding region of the present invention before hot-pressing treatment, figure 2 It is a structural schematic diagram of the protective structure of the silver paste in the binding area of the present invention after hot-pressing treatment, as shown in the figure: the protective structure of the silver paste in the binding area of the present embodiment includes a PET base layer 1, a transparent conductive layer 2, a binding area Silver paste pad 3, special insulating layer 4, conductive particles 5, ACF glue layer 6 and FPC gold finger 7, the PET base layer 1 is located at the bottom, and a transparent conductive layer 2 is on it; on the transparent conductive layer 2 It is a special insulating layer 4, the silver paste pad 3 in the binding area is located inside the special insulating layer 4, and is electrically connected to the transparent conductive layer 2; the AC...
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Abstract
The invention discloses a production method of a bonding area silver paste protection structure. The method includes: firstly, performing silk screen printing of silver paste on a transparent conducting layer attached to a PET (polyethylene terephthalate) substrate by utilizing screen patterns to form sliver paste routes and bonding area silver paste bonding pads; secondly, performing silk screen printing of a special insulation layer on the sliver paste routes and bonding area silver paste bonding pads; thirdly, attaching AFC adhesive onto the bonding area silver paste bonding pads by a sticking machine to form an AFC adhesive layer; finally, aligning FPC (flexible printed circuit) bonding fingers to the bonding area silver paste bonding pads one by one prior to hot pressing. By the silver paste protection structure produced by the method, the problems of damage and air oxidation to the bonding area silver paste and the like can be solved, the structure is particularly targeted to the silver paste printed on carbon nano tubes, metal meshes, silver nanowires, graphene and the like, and damage or stripping of the silver paste due to external force can be reduced.
Description
technical field [0001] The invention relates to a method for preparing a protective structure, in particular to a method for preparing a protective structure of silver paste in a binding region. Background technique [0002] At present, silver paste is widely used in electronic products such as touch screens. However, during the manufacturing process, since the silver paste is exposed, it is necessary to solve the problems of avoiding silver paste damage and being oxidized by air, especially for printing on carbon nanotubes and metal grids. The silver paste on the surface of the binding area on the surface of the bonding area on materials such as silver nanowires, graphene, etc., due to the poor adhesion of the silver paste on this type of transparent conductive film, the risk of being damaged or falling off due to external force is greater. In response to the above problems, the general measure is to print insulating ink on the silver paste traces for protection, but beca...
Claims
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Login to View More IPC IPC(8): G06F3/041
CPCG06F3/0416G06F2203/04103
Inventor 弋天宝余崇圣潘洪亮盖川
Owner CHONGQING GRAPHENE TECH