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Chucks for picking up and transferring semiconductor chips

A semiconductor and collet technology, which is used in semiconductor/solid-state device manufacturing, collets, electrical components, etc., can solve the problem of difficult to separate and attract rubber, semiconductor chips cannot be tightly bonded to lead frames, and attraction forces cannot be applied evenly to semiconductor chips, etc. problems to prevent defects

Active Publication Date: 2017-10-24
PECOTEK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the disclosed chuck, it is difficult to detach the suction rubber for replacement because the plate is coupled in a sealed manner to the plate coupling notch of the chuck holder
[0011] In addition, since only a single vacuum hole is formed for supplying vacuum in the center region of the attracting rubber, the attraction force cannot be uniformly applied to the semiconductor chip during the pick-up process, and thus, for example, the semiconductor chip may be damaged due to the generation of a void therebetween. May not bond tightly to the leadframe
[0012] In addition, when picking up a semiconductor chip, static electricity may be generated between the attracting rubber and the surface of the semiconductor chip, resulting in serious defects in the semiconductor chip

Method used

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  • Chucks for picking up and transferring semiconductor chips
  • Chucks for picking up and transferring semiconductor chips
  • Chucks for picking up and transferring semiconductor chips

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Embodiment Construction

[0050] The terms and words used in this specification and claims should not be construed as limited to the ordinary meanings or dictionary definitions, but should be based on the principle that the inventor can properly define the terms so as to best describe his invention in accordance with the principles of the present invention Technical concepts and ideas to explain.

[0051] In addition, configurations described with reference to the accompanying drawings in the following description do not represent all technical concepts or ideas of the present invention, but should be regarded as exemplary embodiments of the present invention. It should be understood that various modifications and equivalents of the embodiments can be devised within the spirit and scope of the invention at the time of filing.

[0052] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0053] figure 1 is an exploded perspective...

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Abstract

The present invention provides a chuck for picking up and transferring semiconductor chips in a semiconductor packaging process. The chuck is configured to easily detach and replace the attracting rubber from which attractive force is stably applied to the semiconductor chip by fixing and pulling the board out from the outside of the chuck holder for preventing A void is formed in a bonding interface with a lead frame, and the proportion of defective semiconductor chips is minimized by preventing generation of static electricity when picking up and transferring the semiconductor chip by using the attraction rubber.

Description

technical field [0001] The present invention relates to chucks for picking up and transferring semiconductor chips during the manufacture of semiconductor packages, and more particularly, to chucks for picking up and transferring semiconductor chips configured to facilitate the transfer of boards and the attracting rubber is separated from the chuck holder for replacement, improving the attracting performance of the semiconductor chip attracted to the attracting rubber and thereby subsequently preventing the formation of voids in the bonding interface between the semiconductor chip and the lead frame, and precisely , to minimize the proportion of defective semiconductor chips by preventing the generation of static electricity when the semiconductor chips are attracted to the attraction rubber. Background technique [0002] The semiconductor package protects the semiconductor chip from the external environment and is physically attached to the electronic system for electrical...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
CPCH01L21/677H01L21/687H01L21/68778B25J15/0616B25J15/0683H01L21/67126H01L21/67144H01L21/67712H01L21/67721H01L21/6838H05K13/0408
Inventor 李香伊
Owner PECOTEK
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