Method and device for removing copper foil on pins of PCB element

Abstract

The invention discloses a method and device for removing copper foil on pins of a PCB element. The method comprises the steps that resistance-capacitor element pins placed in a copper foil area on a PCB are selected, the positions of the selected pins are clicked, copper foil distribution-forbidding areas are arranged on the clicked pins, and the copper foil on the copper distribution-forbidding areas on the pins of a resistance-capacitor element are automatically removed. According to the method and device, the copper coils can be removed in the copper distribution-forbidding areas arranged on the pins of the resistance-capacitor element only by one key instruction, so that the phenomenon of 'tombstoning' on the pins of the resistance-capacitor element is avoided simply and conveniently, the working efficiency of PCB designing personnel is greatly improved, and the PCB design looks attractive.

Description

technical field [0001] The invention relates to the design and manufacture of a printed circuit board (PCB, Printed Circuit Board) of electronic technology, in particular to a method and a device for removing copper foil at pins of resistance-capacitance elements of the printed circuit board. Background technique [0002] In the reflow soldering process of the surface mount process, the defect of desoldering caused by the packaged resistance-capacitance component (also called 0402 patch) due to standing up is vividly called the "tombstone" phenomenon. To put it bluntly, the "tombstone" phenomenon is caused by the unbalanced surface tension of the two solder ends of the component when the solder paste on the pads at both ends of the component is reflowed and melted, and the solder end with greater tension pulls the component along its bottom. caused by a rotating force. [0003] In order to avoid the "tombstone" phenomenon, try to ensure that the wiring at both ends of the 0...

AI Technical Summary

Problems solved by technology

However, the operation of manually digging copper foil is not only time-consuming and laborious, but also the size of the dug copper foil is often different, which makes the PCB design extremely unsightly, and digging right-angle copper foil is not conducive to PCB factory processing

At the same time, when designing some relatively large PCB boards, 0402 has a lot of SMD components. Using traditional methods to solve the "tombstone" phenomenon requires PCB designers to spend a lot of time and energy, and it is easy to prolong the cycle of PCB design and production.

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