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liquid cooling server

A server, liquid cooling technology, applied in the server field, can solve the problems of limited use site, cumbersome process, huge volume, etc., to avoid the cooling process and complex cooling steps, avoid secondary cooling, and improve cooling efficiency.

Active Publication Date: 2019-04-30
DAWNING INFORMATION IND BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] So in view of the short-circuit problem of water-cooled servers, many liquid-cooled servers using insulating cooling liquid have been derived, but there is a problem whether this kind of liquid-cooled server uses an immersion direct liquid cooling system or an indirect liquid cooling system. The problem is that a device needs to be specially set up inside or outside the server for secondary cooling of the hot steam or hot fluid of the cooling liquid, that is, after exporting the hot steam or hot fluid of the cooling liquid, it also needs to be introduced into the A cooling device is used for secondary cooling, and then the cooled cooling liquid is returned to the heat source of the server. Obviously, this kind of liquid-cooled server with secondary cooling process has complex structure, cumbersome process, The problem of large volume and limited use place

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0037] According to an embodiment of the present invention, a liquid-cooled server is provided.

[0038] Such as figure 1 As shown, the liquid-cooled server according to the embodiment of the present invention includes: a first housing 11 and a second housing 12, wherein,

[0039] The second housing 12 accommodates the first housing 11;

[0040] The interior of the first casing 11 is equipped with a server motherboard, a CPU, and a plurality of electronic components;

[0041] The inside of...

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Abstract

The invention discloses a liquid cooling server. The liquid cooling server comprises a first shell and a second shell, wherein the first shell is accommodated in the second shell; a server main board, a central processing unit (CPU) and a plurality of electronic components are installed in the first shell; the inside of the first shell is filled with silicone oil; a channel which is used for guiding the silicone oil from the first shell into the second shell is formed between the top of the first shell and the top of the second shell, and the channel and the second shell comprise cooling devices which are used for cooling the silicone oil from the first shell; the second shell further comprises a pipeline which is used for enabling the cooled silicone oil to flow back to the first shell; the channel and the pipeline enable the silicone oil to form liquid cooling circulation between the first shell and the second shell. According to the liquid cooling server, the silicone oil is naturally cooled when transferred from the first shell to the second shell, and thereby, complicated cooling processes and steps can be avoided.

Description

technical field [0001] The present invention relates to the field of servers, in particular to a liquid-cooled server. Background technique [0002] Most of the computers currently used rely on cold air to cool down the machine. However, the traditional air-cooled mode is a complex indirect contact cooling method in the heat transfer process. Therefore, there are generally contact thermal resistance and convective heat transfer thermal resistance. If it is a big problem, then when the total thermal resistance is large, the heat transfer efficiency must be low, so the air-cooled system needs a low outdoor low-temperature heat source during use, so as to increase the temperature difference between the inside and outside of the machine, and then guide Obviously, this is a cooling method with low cooling efficiency and high requirements on the external environment. [0003] As we all know, the evaporative cooling method is obviously much more efficient than the air-cooled mode ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/182G06F1/20G06F2200/1638G06F2200/201
Inventor 历军沈卫东范娟刘广辉吴宏杰童中原张卫平孙振王晨
Owner DAWNING INFORMATION IND BEIJING