High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof

A technology of epoxy resin and composition, applied in the field of epoxy resin composition and preparation thereof, can solve the problems of air holes on the surface of plastic encapsulation materials, poor molding process performance, etc., and achieve the effect of high reliability

Inactive Publication Date: 2015-04-15
江苏科化新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance of the molding process is not good, and there are air

Method used

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  • High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof
  • High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof
  • High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] O-cresol novolac epoxy resin A ("N-665" manufactured by DIC Corporation of Japan) 15wt%

[0034] Phenol novolac resin B ("TD-2131" manufactured by DIC Corporation of Japan) 7wt%

[0035] Curing accelerator 2-methylimidazole C 0.5wt%

[0036] Crystalline silica powder D1 (d50 is 25μm) 72wt%

[0037] Ultrafine spherical silica powder E1 ("SC2500SQ" manufactured by Japan's Admatech Corporation, D50 is 0.5 micron) 5%wt%

[0038] Flame retardant 5wt%

[0039] Carnauba Wax 0.4wt%

[0040] γ-glycidyl propyl ether trimethoxysilane 0.5wt%

[0041] Inorganic ion scavenger 0.2wt% (IXE500 (Bi2O3·3H2O) manufactured by TOAGOSEI Co., Ltd, Japan)

[0042] Carbon black 0.5wt%

[0043] Liquid silicone oil 0.3wt%

[0044] Silicone rubber powder 0.5wt% (d50 is 1μm)

[0045] After weighing and mixing uniformly according to the above ratio, melt and knead evenly on a double-roller mixer preheated at a temperature of 70-100°C, remove the uniformly mixed material from the double-roller...

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Abstract

The invention relates to a high-thermal-conductivity environment-friendly type epoxy resin composition and a preparation method thereof. The high-thermal-conductivity environment-friendly type epoxy resin composition is characterized by comprising the following constituents in percentage by weight: 5-10% of epoxy resin, 5-8% of phenolic resin, 70-77% of an inorganic filler, and 3-7% of superfine spherical silicon powder, wherein the epoxy resin composition further comprises one or more of a curing accelerator, a fire retardant, a releasing agent, an inorganic ion capturing agent, a silane coupling agent, a coloring agent and a low-stress modifier. The superfine spherical silicon dioxide powder is added to improve the filling performance of the resin composition, so that the high-thermal-conductivity environment-friendly type epoxy resin composition can meet the requirement that the back thickness of the wholly encapsulated device is less than 0.5 mm, and particularly is suitable for the back thickness of 0.43 mm.

Description

technical field [0001] The invention relates to an epoxy resin composition and a preparation method thereof, in particular to an environment-friendly epoxy resin composition with high thermal conductivity and good molding process performance, which is suitable for fully encapsulating devices, and a method for preparing the composition Preparation. Background technique [0002] In recent years, fully-encapsulated discrete devices have developed faster than half-encapsulated products due to their ease of assembly. Semiconductor packaging materials are required to have high thermal conductivity and excellent molding process performance. It has excellent flame retardant properties and can meet environmental protection requirements. Fully encapsulated devices are mainly used in large and power electronic products. Due to special structural requirements, its package is a typical asymmetric package. The back side of the fully encapsulated device (the side of the heat sink) is g...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08L61/08C08K13/04C08K7/18C08K3/36C08K3/04
Inventor 李刚王善学卢绪奎李海亮余金光
Owner 江苏科化新材料科技有限公司
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