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Treatment liquid supply device and treatment liquid supply method

A technology for supplying devices and processing liquids, applied in chemical instruments and methods, separation methods, filtration and separation, etc., capable of solving problems such as uneven coating

Active Publication Date: 2019-05-10
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In such a photolithography process, there is a problem that air bubbles and particles (foreign matter) such as nitrogen gas are mixed due to various reasons in the resist liquid supplied to the wafer or the like, and the problem of particles (foreign matter). When the treatment liquid for particles is supplied to wafers, etc., there are also problems of uneven coating and defects

Method used

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  • Treatment liquid supply device and treatment liquid supply method
  • Treatment liquid supply device and treatment liquid supply method
  • Treatment liquid supply device and treatment liquid supply method

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Experimental program
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Effect test

no. 1 approach

[0090] Next, refer to image 3 , the first embodiment of the processing liquid supply device of the present invention will be described. The resist liquid supply device 5 of the first embodiment is constituted by a plurality of resist liquid supply systems 500. The resist liquid supply system 500 includes: a resist container 60 for storing a resist liquid L as a processing liquid; (supply) Nozzle for resist liquid L. In addition, the resist liquid supply system 500 includes a filter device 52a provided in the processing liquid supply line 51, which filters the resist liquid L to remove particles, and removes particles mixed in the resist liquid L. Bubbles, particles and other foreign matter in the In addition, the resist liquid supply system 500 includes: pumps P1 and P2 respectively provided in the processing liquid supply lines 51 on the primary side and the secondary side of the above-mentioned filter device 52a; A supply control valve 57 of the supply line 51; and a buf...

no. 2 approach

[0141] based on Figure 27 A resist liquid supply device 511 as a second embodiment will be described. In addition, in the second embodiment and subsequent embodiments, the same components as those in the first embodiment are assigned the same reference numerals, and description thereof will be omitted. In the resist liquid supply device 511, instead of the resist liquid supply system 500, a resist liquid supply system 501 is provided. The resist liquid supply system 501 includes: a capture tank 53 provided in the processing liquid supply line 51 on the secondary side of the filter device 52a; a pump P provided in the processing liquid supply line 51 on the secondary side of the capture tank 53 and the return pipe 55 connecting the discharge side of the pump P to the suction side of the filter device 52a.

[0142] The above-mentioned return pipeline 55 includes: a first return pipeline 55a connecting the capture tank 53 and the pump P; Return with pipeline 55b. Moreover, t...

no. 3 approach

[0160] Figure 38 A resist liquid supply device 512 of the third embodiment is shown. The resist liquid supply device 512 includes a resist liquid supply system 502 instead of the resist liquid supply system 501 described in the second embodiment. This resist solution supply system 502 differs from the resist solution supply system 501 in that the return line 55 is not branched into 55a and 55b. One end of the return line 55 is connected to the pump P via the valve V38, and the other end is connected between the buffer tank 61 and the valve 58 in the second processing liquid supply line 51b. The resist solution supply system 502 has the same configuration as the resist solution supply system 501 except for the structure of the return line 55.

[0161] Also in the resist liquid supply system 502 of the third embodiment, the degassing liquid supply process, the discharge process for discharging the resist liquid to the wafer W, and the circulation filtration process are perfor...

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PUM

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Abstract

The present invention provides a treatment liquid supply device and a treatment solution supply method, so that the treatment liquid is not wasted, effectively inhibiting the increase of particles in the treatment solution. The treatment liquid supply apparatus comprises: a supply source of the treatment liquid for the treatment of the treated body is supplied to the treated body; the discharge part of the treatment liquid is discharged to the treated body via the supply path and the above-described treatment liquid supply source; the filter device disposed of in the above supply path for removing foreign matter in the treatment liquid; the supply pump and the discharge pump on the primary and secondary sides of the filter device are disposed in the above supply path; and the control department, which outputs the control signal, Such that the use of at least one of the above-described supply pump and discharge pump to de-stress the treatment liquid supplied from the above treatment liquid supply source to degass it, and then use the above-described supply pump and discharge pump so that the degassed treatment liquid from the primary side of the filter device through the filter device circulates to the secondary side.

Description

technical field [0001] The present invention relates to a processing liquid supply device and a processing liquid supply method for supplying a processing liquid to an object to be processed, such as a semiconductor wafer or a glass substrate for LCD, for processing. Background technique [0002] In general, in photolithography for the manufacture of semiconductor devices, a photoresist is applied to a semiconductor wafer or an FPD substrate (hereinafter, referred to as a wafer, etc.), The circuit pattern is exposed, and the exposed pattern is developed to form a circuit pattern on the resist film. [0003] In such a photolithography process, there is a problem that air bubbles and particles (foreign matter) such as nitrogen gas are mixed due to various reasons in the resist liquid supplied to the wafer or the like, and the problem of particles (foreign matter). When the treatment liquid for particles is supplied to a wafer or the like, there is also a problem of uneven coa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/027B01D35/02
CPCH01L21/67017H01L21/0274
Inventor 寺下裕一吉原孝介高柳康治古庄智伸佐佐卓志
Owner TOKYO ELECTRON LTD