Treatment liquid supply device and treatment liquid supply method
A technology for supplying devices and processing liquids, applied in chemical instruments and methods, separation methods, filtration and separation, etc., capable of solving problems such as uneven coating
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no. 1 approach
[0090] Next, refer to image 3 , the first embodiment of the processing liquid supply device of the present invention will be described. The resist liquid supply device 5 of the first embodiment is constituted by a plurality of resist liquid supply systems 500. The resist liquid supply system 500 includes: a resist container 60 for storing a resist liquid L as a processing liquid; (supply) Nozzle for resist liquid L. In addition, the resist liquid supply system 500 includes a filter device 52a provided in the processing liquid supply line 51, which filters the resist liquid L to remove particles, and removes particles mixed in the resist liquid L. Bubbles, particles and other foreign matter in the In addition, the resist liquid supply system 500 includes: pumps P1 and P2 respectively provided in the processing liquid supply lines 51 on the primary side and the secondary side of the above-mentioned filter device 52a; A supply control valve 57 of the supply line 51; and a buf...
no. 2 approach
[0141] based on Figure 27 A resist liquid supply device 511 as a second embodiment will be described. In addition, in the second embodiment and subsequent embodiments, the same components as those in the first embodiment are assigned the same reference numerals, and description thereof will be omitted. In the resist liquid supply device 511, instead of the resist liquid supply system 500, a resist liquid supply system 501 is provided. The resist liquid supply system 501 includes: a capture tank 53 provided in the processing liquid supply line 51 on the secondary side of the filter device 52a; a pump P provided in the processing liquid supply line 51 on the secondary side of the capture tank 53 and the return pipe 55 connecting the discharge side of the pump P to the suction side of the filter device 52a.
[0142] The above-mentioned return pipeline 55 includes: a first return pipeline 55a connecting the capture tank 53 and the pump P; Return with pipeline 55b. Moreover, t...
no. 3 approach
[0160] Figure 38 A resist liquid supply device 512 of the third embodiment is shown. The resist liquid supply device 512 includes a resist liquid supply system 502 instead of the resist liquid supply system 501 described in the second embodiment. This resist solution supply system 502 differs from the resist solution supply system 501 in that the return line 55 is not branched into 55a and 55b. One end of the return line 55 is connected to the pump P via the valve V38, and the other end is connected between the buffer tank 61 and the valve 58 in the second processing liquid supply line 51b. The resist solution supply system 502 has the same configuration as the resist solution supply system 501 except for the structure of the return line 55.
[0161] Also in the resist liquid supply system 502 of the third embodiment, the degassing liquid supply process, the discharge process for discharging the resist liquid to the wafer W, and the circulation filtration process are perfor...
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