A red fluorescent glue solid crystal led filament

Abstract

The invention relates to a die bond type LED (light emitting diode) lamp filament with red fluorescent glue and solves the problem of blue light leakage of LED lamp filaments in the prior art. The lamp filament comprises a transparent substrate, at least one face of the substrate is provided with a plurality of LED chips, metal pieces are connected to two ends of the substrate respectively, the LED chips are fixed onto the substrate through a fluorescent glue layer, the fluorescent glue layer is filled between each LED chip and the substrate and wraps around the LED chips, and the LED chips and the fluorescent glue layer are externally wrapped by a glue seal layer. The die bond type LED lamp filament with the red fluorescent glue has the advantages that due to the fact that the fluorescent glue layer wraps around the LED chips to form a first-layer protection film for the LED chips, redundant blue light around the LED chips is absorbed while optical reflection is enhanced; the LED chips are fixed by the aid of the fluorescent glue layer, and consequently adhesion between each LED chip and the substrate is more effectively, and insufficient thrust of wafers is avoided; higher uniformity in light emission and better heat radiation performance are achieved.

Description

Technical field [0001] The invention relates to the technical field of LEDs, in particular to a red fluorescent glue solid crystal LED filament with good light efficiency, stable connection and good heat dissipation. Background technique [0002] Generally speaking, there are two types of packaging methods for LED filaments: potting and dispensing. Since the potting equipment and fixtures used for LED filaments are complex, expensive, and require high precision, the current production of common LED filaments on the market mostly adopts the method of dispensing glue on both sides of the substrate, which effectively reduces the cost of equipment. On the basis of this, the amount of glue can be well controlled. However, the biggest drawback of the method of dispensing glue on the front and back sides is that there is almost no fluorescent glue coating on the two sides of the substrate, which can easily cause blue light leakage of the chip. In addition, most of the die bonding of L...

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the problem of blue light leakage in LED filaments in the prior art, and provides a red fluorescent glue solid crystal LED filament with good light effect

[0004] Another object of the present invention is to solve the problem of poor heat dissipation and light output effects of the current filament, and to provide a red fluorescent glue solid crystal LED filament with good heat dissipation and light output effects

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