Light-emitting diode packaging component

Abstract

The invention relates to a light-emitting diode packaging component. The light-emitting diode packaging component comprises a chip. Extending electrodes are fixedly arranged on the chip. The extending electrodes comprise main electrodes and electrode extending ends connected with the main electrodes. The light-emitting diode packaging component further comprises a baseplate arranged to be opposite to the chip. Deviation preventing bonding pads are fixedly arranged on the baseplate. The deviation preventing bonding pads are capable of containing the main electrodes and extending to contain at least parts of the electrode extending ends, wherein the extending electrodes and the deviation preventing bonding pads are welded together to achieve the electric connection between the chip and the baseplate. During the welding process, the relatively stillness between the extending electrodes and the corresponding deviation preventing bonding pads can be achieved. The light-emitting diode packaging component is capable of preventing the deflexion and excursion of the chip relative to the baseplate during the process of flip-chip bonding.

Description

technical field [0001] The invention relates to an electronic component, in particular to a light emitting diode package. Background technique [0002] A diode package generally includes a chip provided with electrodes and a substrate provided with pads. Chip and substrate can be electrically connected together by flip-chip bonding. In order to make the current density of the light-emitting layer of the chip more uniform and the light-emitting efficiency of the chip higher, electrode extension ends are generally arranged on the electrodes. [0003] In the prior art, square pads are mostly used on the substrate of the diode package. During the process of flip-chip soldering, the electrode extensions will be deflected to the corners of the square pads under the action of the surface tension of the liquid solder, so as to ensure that the electrode extensions are accommodated in the pads as much as possible. However, during the deflection process of the electrode extension re...

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Problems solved by technology

However, during the deflection process of the electrode extension relative to the pad, other electrodes arranged on the chip are likely to deviate or even break away from the pad due to the deflection of the electrode.

Especially in the process of soldering, it is difficult to ensure that the solder on different pads melts at the same time, and there is generally a delay time

As a result, the melted solder will drive the electrode extension to deflect, while the electrode and its extension at the unmelted solder are not balanced by the surface tension of the liquid solder, which makes the chip easier to deflect or even shift relative to the substrate. As a result, the electrodes and their extensions cannot be properly connected to the pads

This will lead to the abnormal electrical connection between the chip and the substrate, which will greatly affect the product yield of the LED package.

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