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Mold with uniform heating function

A uniform heating and molding technology, applied in the field of molds, can solve the problems of flawed appearance and turbulent flow of finished products

Active Publication Date: 2015-04-29
SUZHOU BOAO PLASTIC ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flow rate of the molten material in the mold cavity of the male and female modules is inconsistent, and turbulent flow is prone to occur. This is caused by water ripples and joint lines on the finished plastic parts, and the air in some membrane cavities is too late to be discharged. air bubbles, making the appearance of the finished product flawed

Method used

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  • Mold with uniform heating function

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing and embodiment, the specific embodiment of the present invention is described in further detail. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0017] see figure 1 A mold with uniform heating described in a preferred embodiment of the present invention includes a mold base 1, a film core 2 arranged on the mold base 1 and an intermediate structure 3 arranged between the mold base 1 and the film core 2, A mold cavity 11 is formed in the mold base 1 , and the film core 2 is accommodated in the mold cavity 11 . The intermediate structure 3 includes a magnetic powder layer 31 disposed at the bottom of the cavity 11 , a telescopic heat exchange chamber 32 disposed between the magnetic powder layer 31 and the film core 2 , and an energizable coil 33 disposed in the telescopic heat exchange chamber 32 . Since the magnetic powder layer 31 is ...

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Abstract

The invention relates to a mold with the uniform heating function. The mold comprises a mold seat, a membrane kernel arranged on the mold seat and an intermediate structure arranged between the mold seat and the membrane kernel, wherein mold grooves are formed in the mold seat, and the membrane kernel is accommodated in the mold grooves; the intermediate structure comprises a magnetic powder layer arranged at the bottoms of the mold grooves, a telescopic heat exchange cavity formed between the magnetic powder layer and the membrane kernel, and electrified coils arranged in the telescopic heat exchange cavity; the mold seat comprises a base, movable parts arranged on the base and connecting rods for connecting the movable parts and the base, wherein the connecting rods comprise polish rod parts arranged in the movable parts and external thread parts formed in the bottoms of the polish rod parts, internal thread parts for matching with the external thread parts of the connecting rods in a threaded manner are formed in the base, and the movable parts are driven by the connecting rods to move relative to the base, so that the size of the telescopic heat exchange cavity is changed.

Description

technical field [0001] The invention relates to a mold with uniform heating. Background technique [0002] Plastic molding methods are divided into injection molding, blow molding, hot press molding, compression molding, extraction molding, etc. The above molding process is to heat the plastic to a molten state and fill it into the mold, and then cool and solidify to form a finished plastic part. [0003] Plastic products produced by injection molding have the advantages of complex structure, precise size and safe quality in terms of shape. However, in the existing injection molding process, when the molten material is injected into the cavity of the male and female modules, the contact between the high-temperature molten material and the cooled cavity wall will form a thin solidified layer, and the molten material close to the wall The temperature will also be lowered accordingly, so that the flow velocity of the molten material is the maximum at the center position, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/26B29C45/73
CPCB29C45/0025B29C45/26B29C45/2602B29C45/73
Inventor 胡波丁铭
Owner SUZHOU BOAO PLASTIC ELECTRONICS