Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Metal film material Young modulus test structure

A technology for testing structure and Young's modulus, applied in the direction of applying stable tension/pressure to test the strength of materials, can solve problems such as limitations, and achieve the effect of simple test method, low test equipment requirements, and wide adaptability

Inactive Publication Date: 2015-04-29
SOUTHEAST UNIV
View PDF10 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since metal is usually used as the last and uppermost layer of material, there are some restrictions on how to make the test structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Metal film material Young modulus test structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Attached below figure 1 The present invention will be further described.

[0025] The test structure of the present invention is made up of five parts: the first thermal expansion force source 101 with micrometer vernier; The second thermal expansion force source 102 with micrometer vernier; The metal member 103 to be stretched; Double-end fixed support beam 104; Loading drive The two anchor regions of the current are the first anchor region 100-1 loaded with the driving current and the second anchor region 100-2 loaded with the driving current. Among them, the first thermal expansion force source 101 with the micrometer vernier, the second thermal expansion force source 102 with the micrometer vernier and the double-end fixed beam 104 are all made of polysilicon material with known Young's modulus and residual stress.

[0026] The first thermal expansion force source 101 with a micrometer vernier is formed by connecting a gate-shaped thermal expansion driving structur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a metal film material Young modulus test structure. The test structure comprises five parts, namely a first heat swelling power source with a micrometer vernier, a second heat swelling power source with a micrometer vernier, a metal part to be stretched, a double-end fixed support beam and an anchoring area for loading drive current. Both the heat swelling power source with the micrometer vernier and the double-end fixed support beam are made of a polycrystalline silicon material with known Young modulus and residual stress. The metal film material Young modulus test structure can be used for measuring the Young modulus of a metal film and also can be used for measuring the residual stress of the metal, the breaking strength and the Young modulus close to the breaking by controlling the test process.

Description

technical field [0001] The invention provides a test structure for the Young's modulus of a metal thin film material. The invention belongs to the technical field of microelectromechanical system (MEMS) material parameter testing. Background technique [0002] The performance of MEMS is closely related to the material parameters. Due to the influence of the processing process, some material parameters will change. These uncertain factors caused by the processing technology will make device design and performance prediction uncertain and unstable. The purpose of material parameter testing is to be able to measure the material parameters of MEMS devices manufactured by a specific process in real time, monitor the stability of the process, and feed back the parameters to the designer so that the design can be corrected. Therefore, testing without leaving the processing environment and using general-purpose equipment has become a necessary means of process monitoring. The phy...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01N3/08
Inventor 李伟华王雷张璐周再发
Owner SOUTHEAST UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com