Structure for testing Young modulus of thick film silicon material on insulating substrate

Abstract

The invention provides a structure for testing the Young modulus of a thick film silicon material on an insulating substrate, and the structure is used for measuring the Young modulus of the thick film silicon material on the insulating substrate. The testing structure consists of three parts, including an opposite type electro-thermal driving unit, a stopping unit provided with a micrometer vernier, and an electrostatic driven cantilever beam unit, wherein the opposite type electro-thermal driving unit is vertically connected with the stopping unit provided with the micrometer vernier; the electrostatic driven cantilever beam unit is used for doing in-plane horizontal bending motion; the stopping structure is used for controlling the bending degree and preventing connection so as not to cause unstable measurement; the movement of the stopping structure is realized by a thermal expansion driving structure; the movement amount of the stopping structure is measured by the vernier. For preventing inaccurate position measurement caused by technological errors, the position is measured twice, namely the stopping structure is thermally driven to have contact with a cantilever beam for the first time so as to read the position of the vernier, a tiny clearance generated by driving current is reduced, and the clearance is recorded by the vernier, namely the final bending deflection.

Description

technical field [0001] The invention provides a testing structure for Young's modulus of thick film silicon material on an insulating substrate. The invention belongs to the technical field of microelectromechanical system (MEMS) material parameter testing. Background technique [0002] The performance of microelectromechanical devices is closely related to material parameters. Due to the influence of processing, some material parameters will change. These uncertain factors caused by processing technology will make device design and performance prediction uncertain and unstable. Case. The purpose of material parameter testing is to be able to measure the material parameters of MEMS devices manufactured by a specific process in real time, monitor the stability of the process, and feed back the parameters to the designer so that the design can be corrected. Therefore, testing without leaving the processing environment and using general-purpose equipment has become a necessar...

AI Technical Summary

Problems solved by technology

An important problem in the electrostatic drive method is the pull-in phenomenon. Since the pull-in phenomenon is an unsteady state, the accuracy of the measurement data is also unstable. Therefore, the pull-in phenomenon should be avoided as much as possible in the electrostatic drive structure.

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