Computer radiating system

A cooling system and computer technology, applied in computing, instruments, electrical and digital data processing, etc., can solve the problems of unsatisfactory cooling effect, poor cooling effect, easy entry of dust, etc., so as to improve the cooling effect and reduce the air outlet. Setting, good dustproof effect

Inactive Publication Date: 2015-04-29
HUANGGANG POLYTECHNIC COLLEGE
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] People usually use the computer continuously for a long time, especially for office work, which may last for a whole day, and the hardware on the computer is also more, especially the heat generated by the motherboard, graphics card, and power supply. The technology uses the form of a fan to accelerate the air flow to achieve cooling, but the general fan will basically make different degrees of sound after one year of use, and the cooling effect is not so good, and it is easy to enter dust; To overcome these problems, some use water cooling to dissipate heat from the main chassis of the computer, and achieve cooling through heat transfer, but this method requires arranging multiple curved tubes on the casing to increase the contact between the tubes and the heat dissipation surface The chassis using this cooling method tends to be relatively heavy, and the heat dissipation effect is not very ideal.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Computer radiating system
  • Computer radiating system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0017] Such as figure 1 and figure 2 As shown, a computer heat dissipation system includes a chassis, the chassis includes a housing 1 and a heat dissipation assembly, and the heat dissipation assembly includes a water tank 2, an upper water pipe 3, a water tank 4, a water outlet pipe 5, a water flow adjustment assembly, a cooling plate 6 and Fin set 7, the lower end of the upper water pipe 3 communicates with the water tank 2 through the water pump 8 arranged in the water tank 2, the upper end of the upper water pipe 3 communicates with the water tank 4, and both sides of the water tank 4 are provided with outlet pipes 5 One end of the outlet pipe 5 commun...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a computer radiating system which comprises a case. The case comprises a casing and a radiating assembly. The radiating assembly comprises a water channel, a water feeding pipe, a water tank, a water discharging pipe, a water flow adjusting assembly, a cooling plate and a fin group. The water discharging pipe and the water flow adjusting assembly are arranged on two sides of the water tank. The water flow adjusting assembly comprises a round water pipe and a partition plate. The partition plate is arranged in the water pipe, the middle axis of the water pipe is located on the plane of the partition plate, one side of the partition plate is connected with the pipe wall of the water pipe in a sealing mode, a gap is formed between the other side of the partition plate and the pipe wall of the water pipe, a water inlet and a water outlet are arranged in the water pipe on two sides of the partition plate, the water inlet is connected with the water feeding pipe, and the water outlet is communicated with a cooling cavity. The computer radiating system adopts the waterfall type water cooling mode to conduct heat exchange in the case, improves the computer radiating speed, omits a fan, reduces noise, omits air ports, and achieves a good dustproof effect.

Description

technical field [0001] The invention relates to a computer cooling system. Background technique [0002] With the development of science and technology and the progress of society, computers have become an indispensable electronic device in people's daily life, and today's life and office are inseparable from computers. [0003] People usually use the computer continuously for a long time, especially for office work, which may last for a whole day, and the hardware on the computer is also more, especially the heat generated by the motherboard, graphics card, and power supply. The technology uses the form of a fan to accelerate the air flow to achieve cooling, but the general fan will basically make different degrees of sound after one year of use, and the cooling effect is not so good, and it is easy to enter dust; To overcome these problems, some use water cooling to dissipate heat from the main chassis of the computer, and achieve cooling through heat transfer, but this m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/182G06F1/20G06F2200/201
Inventor 周源余静
Owner HUANGGANG POLYTECHNIC COLLEGE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products