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Modular integrated circuit packaging structure and manufacturing method thereof

A technology of integrated circuit and packaging structure, which is applied in the field of module integrated circuit packaging structure and its production to improve heat dissipation performance, can solve the problem of not providing heat dissipation performance of heat conduction structure, and achieve the effect of improving heat dissipation performance

Active Publication Date: 2017-10-27
纮华电子科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the known functional modules do not additionally provide a heat conduction structure to improve heat dissipation performance

Method used

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  • Modular integrated circuit packaging structure and manufacturing method thereof
  • Modular integrated circuit packaging structure and manufacturing method thereof
  • Modular integrated circuit packaging structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0054] See Figure 1 to Figure 6 As shown, the present invention provides a method for manufacturing a module integrated circuit packaging structure Z for improving heat dissipation efficiency, which includes the following steps:

[0055] First, step S100 is: cooperate figure 1 and figure 2 As shown, a circuit substrate 10 is provided, and then a plurality of electronic components 20 are arranged on the circuit substrate 10 to be electrically connected to the circuit substrate 10, and then an encapsulant 30 is formed on the circuit substrate 10 to cover the plurality of electronic components 20. Furthermore, the plurality of electronic components 20 can be divided into at least one first electronic component 21 and at least one second electronic component 22, and the heat generated by the at least one first electronic component 21 is greater than that of the at least one second electronic component 22 The heat generated. For example, the plurality of electronic components 20 m...

no. 2 example

[0064] See Figure 8 and Picture 9 As shown, the second embodiment of the present invention can provide a module integrated circuit packaging structure Z for improving heat dissipation efficiency, which includes: a substrate unit 1, an electronic unit 2, a packaging unit 3, and a first heat dissipation unit 4 And a second heat dissipation unit 5. by Figure 8 versus Figure 7 The comparison shows that the biggest difference between the second embodiment of the present invention and the first embodiment is:

[0065] First, in the second embodiment, the substrate unit 1 includes a ground layer 11 disposed inside the circuit substrate 10 and completely covered by the circuit substrate 10, and an outer conductive structure 12 disposed on the outer periphery 100 of the circuit substrate 10. , And an inner conductive structure 13 disposed inside the circuit substrate 10 and electrically connected between the ground layer 11 and the outer conductive structure 12. In addition, the oute...

no. 3 example

[0068] See Picture 10 As shown, the third embodiment of the present invention can provide a module integrated circuit packaging structure Z for improving heat dissipation efficiency, which includes: a substrate unit 1, an electronic unit 2, a packaging unit 3, and a first heat dissipation unit 4 And a second heat dissipation unit 5. by Picture 10 versus Figure 8 It can be seen from the comparison that the biggest difference between the third embodiment of the present invention and the second embodiment is that: in the third embodiment, the substrate unit 1 includes a ground layer 11 provided inside the circuit substrate 10 and a ground layer 11 provided on the circuit substrate 10. An outer conductive structure 12 on the periphery 100 is surrounded. In addition, the outer conductive structure 12 includes a plurality of outer conductive layers 120 disposed on the outer periphery 100 of the circuit substrate 10. The ground layer 11 is exposed from the outer circumference 100 ...

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Abstract

A module integrated circuit package structure and its manufacturing method. The module integrated circuit package structure includes: a substrate unit, an electronic unit, a package unit, a first heat dissipation unit and a second heat dissipation unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The encapsulation unit includes an encapsulant disposed on the circuit substrate and covering a plurality of electronic components. The first heat dissipation unit includes a heat dissipation base layer directly disposed on the top surface of the encapsulant. The second heat dissipation unit includes a plurality of heat dissipation auxiliary layers directly disposed on the top surface of the heat dissipation base layer. Therefore, the present invention can effectively improve the heat dissipation performance of the module integrated circuit packaging structure through the design of "the heat dissipation base layer disposed on the encapsulant" and "a plurality of heat dissipation auxiliary layers disposed on the heat dissipation base layer".

Description

Technical field [0001] The invention relates to a module integrated circuit packaging structure and a manufacturing method thereof, in particular to a module integrated circuit packaging structure for improving heat dissipation efficiency and a manufacturing method thereof. Background technique [0002] In recent years, the rapid growth of science and technology has caused various products to move towards the application of combined science and technology, and they are also constantly progressing and developing. In addition, as products have more and more functions, most of the current products are integrated and designed in a modular way. However, the integration of multiple modules with different functions in the product can greatly increase the functions of the product. However, under the current demand for product miniaturization and exquisite appearance, how to design a product that has both small size and multiple functions Products are the targets that all walks of life a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H01L21/48
Inventor 简煌展
Owner 纮华电子科技(上海)有限公司