PCB back drilling plate back drilling depth detecting method

Abstract

The invention discloses a PCB back drilling plate back drilling depth detecting method which comprises the steps that a back drilling layer of a back drill and three different testing holes of up-down adjacent layers are connected with shared communication holes of corresponding layers respectively in a line mode, and a line penetrates through the back drilling holes in the same layer horizontally; a drilling mouth is used for carrying out hole drilling on three testing holes of each testing strip and the shared communication holes; a pre-drilling hole is additionally drilled at a back drilling hole position of each testing strip, and the diameter of the pre-drilling hole is smaller than a back drilling hole; and when back drilling is carried out on the pre-drilling hole, whether back drilling depth meets requirements is determined by connecting-disconnecting testing. The method is simple in design and high in testing efficiency, process monitoring is convenient, equipment does not need to be added and changed, only design needs to be changed, and the purpose of quality monitoring can be achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for detecting the back-drilling depth of a PCB back-drilled board. Background technique [0002] With the development of the electronics industry, in the PCB production process, the back-drilling process is a special production process, which is mainly to drill out the parts that do not need to be conducted on the original interlayer via holes that cause electrical signal noise, so that The remaining layers remain connected. [0003] In the production process, it is often difficult to control the depth of back drilling, which leads to the failure of back drilling. For back-drilled boards with unqualified depth, it is difficult to judge during the production process. Generally, it has to be measured and judged by slicing, so that there will be unnecessary slicing and scrapping in the production of such boards, and at the same time, it cannot achi...

AI Technical Summary

Problems solved by technology

[0008] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for detecting the back-drilling depth of a PCB back-drilling board, aiming at solving the problems of comprehensive monitoring, waste of materials, difficulty in testing, low efficiency, and poor quality of existing detection methods. risk issue

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