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Metal outer surface film lamination method and device, and metal housing

A metal shell and outer surface technology, applied in the field of electronics, can solve the problems of poor adhesion between the ink layer and the stainless steel substrate, poor coverage of the outer surface of the stainless steel, etc., and achieve the effect of improving the coverage and enhancing the adhesion.

Inactive Publication Date: 2015-04-29
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

The current metal coating process is to directly spray ink on the outer surface of the stainless steel substrate. It has been verified that the adhesion of the ink layer to the stainless steel substrate is very poor in this metal coating process, and the coverage of defects on the outer surface of the stainless steel is poor.

Method used

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  • Metal outer surface film lamination method and device, and metal housing
  • Metal outer surface film lamination method and device, and metal housing
  • Metal outer surface film lamination method and device, and metal housing

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Embodiment Construction

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] please participate figure 1 , figure 1 It is a schematic flow chart of a method for coating a metal outer surface provided by an embodiment of the present invention. like figure 1 The metal outer surface coating method in the embodiment shown may include:

[0021] S101, cleaning a stainless steel substrate, the cleaning includes washing and degreasing.

[0022] Specifically, the stainless steel base material is punched and cut to ...

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Abstract

The embodiment of the invention discloses a metal outer surface film lamination method, which comprises the following steps: cleaning a stainless steel substrate, wherein cleaning comprises washing and oil removal; plating a metal film layer on the outer surface of the stainless steel substrate by virtue of a physical vapor deposition method; printing an ink layer on the metal film layer of the stainless steel substrate. Correspondingly, the embodiment of the invention further discloses a metal outer surface film lamination device and a metal housing. According to the embodiment of the invention, the adhesion of the ink layer and the stainless steel substrate can be enhanced, and the defect covering power of the outer surface of the stainless steel substrate can be improved.

Description

technical field [0001] The present invention relates to the field of electronic technology, in particular to a method, a device and a metal casing for coating a metal outer surface. Background technique [0002] At present, in order to improve the aesthetics of the terminal and attract more users, many manufacturers use stainless steel for the casing of the terminal. In order to obtain a more delicate and smooth appearance, the process of metal coating is generally used. At present, the metal coating process is to spray ink directly on the outer surface of the stainless steel substrate. It has been verified that this metal coating process has very poor adhesion between the ink layer and the stainless steel substrate, and poor coverage of defects on the outer surface of the stainless steel. SUMMARY OF THE INVENTION [0003] The invention provides a metal outer surface coating method, device and metal casing, which can enhance the adhesion between an ink layer and a stainles...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/04C23C14/16B32B15/01
Inventor 张涛孙文峰
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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