Laser cutting device

A technology of laser cutting and laser cutting head, applied in laser welding equipment, optics, nonlinear optics, etc., can solve the problems of liquid crystal panel cannot be found, liquid crystal panel inflow, and laser cutting device cannot detect the edge of liquid crystal panel, etc. The effect of simple structure, easy assembly, and easy promotion and application

Active Publication Date: 2017-05-17
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the laser cutting device cannot detect the damage at the edge of the liquid crystal panel, so that the defective liquid crystal panels cannot be found, and these defective liquid crystal panels flow into the next workshop or manufacturer

Method used

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  • Laser cutting device
  • Laser cutting device

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing.

[0024] figure 1 Shown is a laser cutting device 10 according to the present invention, which is commonly known as a liquid crystal screen short-circuit ring laser cutting machine. The laser cutting device 10 can be used for cutting short-circuit rings of TFT-LCD liquid crystal panels (that is, liquid crystal panels of thin film transistor liquid crystal displays). exist figure 1 In the coordinate system shown, the T-axis represents the horizontal direction, and the V-axis represents the vertical direction.

[0025] The laser cutting device 10 includes a laser cutting head 2 capable of emitting a laser beam. The pulsed laser light emitted by the laser cutting head 2 can reach an appropriate energy density after beam expansion and focusing, and cut the short-circuit ring connection line at the edge of the liquid crystal panel 5 along the moving path 6, prompting the instan...

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Abstract

A laser cutting device (10) is used to cut a short-circuit ring wire of a liquid crystal panel (5). The laser cutting device (10) comprises a laser cutting head (2) used to cut the short-circuit ring wire of the liquid crystal panel (5), and a first detector (3) provided out of the laser cutting head (2) and used to detect the breakage of the edge of the liquid crystal panel (5). The laser cutting device (10) detects the breakage of the edge of the liquid crystal panel (5) by means of the first detector (3), so that the defective liquid crystal panel (5) can be found in time and prevented from flowing into next plant or manufacturer.

Description

technical field [0001] The invention relates to a laser cutting device, in particular to a laser cutting device used for cutting short-circuit ring wiring of a liquid crystal panel. Background technique [0002] With the rapid development of today's society, the automatic production of LCD panels has been promoted to an efficient and high-quality production road. Every link in the production of LCD panels needs to strictly monitor the quality to prevent defective products from flowing into the next workshop or manufacturer. [0003] In the production process of the liquid crystal panel, it is necessary to use the existing laser cutting device to cut the short-circuit ring connection at the edge of the liquid crystal panel, so as to ensure that the liquid crystal panel after installing the IC drive element and the circuit board can operate normally. [0004] However, the existing laser cutting device can use laser to cut the short-circuit ring connection, and detect the disco...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38G02F1/13
CPCB23K26/38
Inventor 符夏龙黄皓
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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