Plate cutting and drilling method

Abstract

The invention discloses a board cutting and target drilling method; and the cutting treatment and the target drilling treatment are performed for a multilayer board in one stand to form a circuit board. The board cutting and target drilling method comprises the following steps: (S1) the multilayer board is fixed on a working platform; (S3) a preset cutting and target drilling position of the multilayer board is set by an X-ray positioning unit of the stand, and a present position of the multilayer board is obtained; (S5) the multilayer board is adjusted from the present position to the preset cutting and target drilling position by horizontally adjusting the working platform; (S7) the multilayer board is cut by a cutting unit in the stand; and (S9) multiple target holes are drilled in the multilayer board by a target drilling unit in the stand to form the circuit board. Through the design, the position adjusting times of the multilayer board can be reduced, the production time can be shortened, and the equipment installation space can be saved.

Description

technical field [0001] The invention relates to a board body cutting and drilling method, which enables the laminated multi-layer boards to perform position calibration, cutting processing and drilling target processing on a working platform, thereby shortening the production time and saving equipment setting space. Background technique [0002] It is known that the circuit board is formed by cutting and drilling the laminated multi-layer board, and depending on the quality of the cutting process, the user will perform edge grinding according to the situation. [0003] The above-mentioned cutting process is to cut off the irregular glue overflow of the laminated multi-layer board, and make the shape of the multi-layer board meet the needs of users. [0004] In the known technology, the cutting process, the target drilling process and the edging process are usually carried out separately in three kinds of equipment. For the user, not only the installation of the equipment ta...

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Problems solved by technology

[0004] In the known technology, the cutting process, the target drilling process and the edging process are usually carried out separately in three kinds of equipment. For the user, not only the installation of the equipment takes up a lot of space, but also the user must perform multi-layer grinding on each equipment separately. Plate position calibration, such a production process will increase the production time

[0005] In addition, those with ordinary knowledge in the technical field should understand that the positioning unit in the drilling device or the cutting device uses two lenses to obtain the current position of the multilayer board, and set the drilling target position or cutting position of the multilayer board. cutting position, so that the position of the multilayer board can be calibrated; however, the field of view (FOV, Field of View) of the known lens is about 50mmX50mm, so when the irregular glue overflow of the multilayer board is closer than the edge of the multilayer board When it is more than 30mm, these positioning units will not be able to know the current position of the multi-layer board, and cannot set the drilling target position or cutting position for the multi-layer board, so that the multi-layer board cannot be processed by drilling target or cutting

[0006] More specifically, in the existing technology, the cutting equipment must first rely on the positioning edge of the multilayer board before positioning with the help of the lens. However, it should be understood that when the user performs target drilling on the multilayer board, many The plywood still has irregular edges, making it difficult to lean the plywood against the positioning edge in this cutting machine

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