The present invention aims to provide a substrate processing apparatus and a substrate processing method which simplifies the structure of the apparatus, reduces the installation space, reduces steps of transferring the substrate, and improves the substrate processing speed by integrally forming a load-lock unit in a process chamber. In the substrate processing apparatus (1) of the present invention to implement this, a first chamber (100) among a plurality of chambers for processing a substrate in a vacuum state integrates a front end module with a load lock portion (100a) for loading and unloading the substrate therebetween. The loading and unloading of the substrate is performed in a state where a first space (S1) of the first chamber (100), where the load lock portion (100a) is located, and a second space (S2) of the first chamber (100), which is provided below the first space (S1) and communicates with the plurality of chambers, are spatially isolated from each other.