A detachable fpga verification development board with high-speed operation

Abstract

The invention discloses a detachable and high-speed verification development board for FPGA, comprising a development board, a socket located on the development board and an FPGA chip detachably connected to the socket. The socket is welded on the pad; the socket is provided with a pin corresponding to the FPGA solder ball, the upper end of the pin is connected to the solder ball of the FPGA chip, and the lower end is connected to the trace on the development board. The chip is electrically connected to the components on the development board through the pins of the socket; in order to cooperate with the fast running speed of the FPGA chip, a memory that can access data at a high speed (Flash chip, FRAM chip and DDR3 chip) is arranged around it. ), according to FPGA programming, these chips can be called individually or simultaneously to ensure the high-speed operation of the development board. The FPGA chip can be disassembled and assembled manually on the development board, no other equipment is required, the disassembly and assembly is convenient, and the chip will not be damaged, and can be disassembled and assembled repeatedly; at the same time, the design of the development board gives full play to the advantages of the FPGA chip in parallel processing of data. Can fully meet the needs of design verification.

Description

technical field [0001] The invention relates to an FPGA-based verification and development board, in particular to a verification and development board with detachable FPGA and high-speed operation, belonging to the field of computer hardware. Background technique [0002] The verification development board based on FPGA (Field Programmable Gate Array, Field Programmable Gate Array) is a circuit board developed to meet the needs of design verification by utilizing the advantages of FPGA chip field programmable and data parallel processing. High-speed FPGA chip. Usually, the FPGA chip is directly soldered on the development board, or the FPGA chip is soldered on the PCB adapter board, and then connected to the development board through the adapter board. There is a problem: when the FPGA chip is damaged or the capacity and speed of the FPGA cannot To meet the demand, when it needs to be replaced, it will be very troublesome to replace the FPGA chip, requiring professional eq...

AI Technical Summary

Problems solved by technology

Usually, the FPGA chip is directly soldered on the development board, or the FPGA chip is soldered on the PCB adapter board, and then connected to the development board through the adapter board. There is a problem: when the FPGA chip is damaged or the capacity and speed of the FPGA cannot To meet the demand, when it needs to be replaced, it will be very troublesome to replace the FPGA chip, requiring professional equipment, and the expensive FPGA chip may be damaged during the operation

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