A kind of stripping method of flexible substrate
A flexible substrate and rigid substrate technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of narrow application range and high peeling energy, and achieve the effect of convenient operation and simple realization.
Active Publication Date: 2018-10-19
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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However, this patent application is only applicable to special clay substrates, and the release layer can only be a-Si, so the scope of application is very narrow; and, from the perspective of implementation, this patent application still requires high peeling energy, and still needs such Complex devices such as lasers
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[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.
[0029] Such as figure 1 As shown, the stripping method of the flexible substrate of the present invention includes:
[0030] Step 1: Form an amorphous release layer on the hard substrate, the release layer is made of a material that can form flaky crystals after being heated;
[0031] Step 2: forming the flexible substrate on the release layer;
[0032] Step 3: making electronic or optical devices on the flexible substrate;
[0033] Step 4: heating the release layer to transform the release layer into an easily peelable layered structure, and peel the flexible substrate from the hard substrate.
[0034] Among them, the material that forms the release layer and has the property ...
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Abstract
The invention discloses a method for stripping a flexible substrate. The method comprises the following steps: A, forming a non-crystalline release layer on a hard substrate, wherein the release layer is made of a material which can form flaky crystalline after being heated; B, forming a flexible substrate on the release layer; C, manufacturing an electronic or optical device on the flexible substrate; and D, heating the release layer to transform the release layer into a layered structure which is easy to strip, and stripping the flexible substrate from the hard substrate. According to the method for stripping a flexible substrate of the invention, the characteristic of the release layer material, namely, the material forms flaky crystalline after being heated, is utilized, the release layer is transformed into a layered structure which is easy to strip through heating after the electronic or optical device is manufactured on the flexible substrate, and thus the flexible substrate can be stripped from the hard substrate very easily and conveniently. The method of the invention does not require large equipment, and is simple in implementation and easy in operation.
Description
technical field [0001] The invention relates to a flexible electronic device manufacturing technology, in particular to a method for peeling off a flexible substrate when manufacturing a flexible electronic device. Background technique [0002] Flexible optoelectronics, that is, optoelectronic devices, such as displays, chips, circuits, power supplies, sensors, etc., are fabricated on bendable substrates to achieve functions, costs, or user experience advantages that traditional optoelectronic devices cannot achieve. Since traditional hard substrates are compatible with traditional equipment and can be precisely aligned to form fine patterns, etc., the preparation of existing mainstream flexible devices, such as flexible AMOLEDs, requires the flexible substrate to be prepared or adsorbed on the surface of the hard substrate first. After preparation, the flexible substrate is peeled off from the hard substrate. Therefore, the exfoliation technique becomes the key to the prod...
Claims
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IPC IPC(8): H01L21/683
CPCH01L21/48H01L21/6835H01L2221/68386
Inventor 朱少鹏敖伟陈红黄秀颀
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD