Packaging structure and packaging method for fingerprint identification module
A fingerprint recognition module and fingerprint recognition technology, which is applied in character and pattern recognition, instruments, electrical components, etc., can solve the problems of low sensitivity and recognition efficiency, high cost, and poor compression resistance of fingerprint recognition modules, so as to improve sensitivity and recognition efficiency, increase resistance to oppression, and reduce the effect of distance
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[0047] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for ease of description, the drawings only show part but not all of the content related to the present invention, and the size and size of the structure shown in the drawings are not actual or in proportion to the actual The size of the structure.
[0048] figure 2 It is a flowchart of a packaging method for a fingerprint identification module provided by an embodiment of the present invention. The fingerprint identification module encapsulated by this method can be applied to mobile terminals such as mobile phones, tablets, laptops, or media players, or Used in financial terminal equipment such as ATM machines. Such as figure 2 As shown, the packaging method of the fing...
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