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Structure and manufacturing process of a kind of LED lighting module

A manufacturing process and technology of light-emitting modules, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of complex process and high cost, and achieve the effects of high heat conduction efficiency, reducing temperature rise, and improving light output efficiency

Inactive Publication Date: 2017-10-20
莆田康布斯光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the defects of complex process and high cost in the production of existing LED modules, the present invention proposes a structure and manufacturing process of LED light emitting modules, and its technical scheme is as follows:

Method used

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  • Structure and manufacturing process of a kind of LED lighting module
  • Structure and manufacturing process of a kind of LED lighting module
  • Structure and manufacturing process of a kind of LED lighting module

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Embodiment Construction

[0043] Such as Figure 1 to Figure 3 As shown, a schematic diagram of the manufacturing process of an embodiment of the present invention is shown;

[0044] Such as figure 1 Shown, is step 1), this step provides a substrate 1, and this substrate 1 comprises from bottom to top:

[0045] A single-layer aluminum bottom plate 10, the aluminum bottom plate 10 is made of more than 99.85% aluminum material, and is located at the bottom layer; there is a fixed layer 20 on it;

[0046] The silver layer 30 adopts the coating process of physical vapor deposition (PVD-Coating), covers the upper surface of the fixed layer 20 and cooperates with it; the purity of the silver layer 30 is greater than 99.9%, about 99.95%, and its upper surface is Reflective surface, that is, the structure of the mirror surface;

[0047] There is an oxide layer 40 on the upper surface of the silver layer 30. The oxide layer 40 can adopt various processes. In this solution, the upper surface of the silver lay...

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Abstract

The invention belongs to the field of LED lighting, and discloses a structure and manufacturing process of an LED light-emitting module. There is a fixed layer on the upper surface of the bottom plate; the silver layer obtained by physical vapor deposition covers and cooperates with the upper surface of the fixed layer; the purity of the silver layer is greater than 99.9%, and its upper surface is a reflective surface; and reflective The oxide layer is located on the upper surface of the deposited silver layer; it is obtained by setting a layer of insulating adhesive glue on the upper surface of the oxide layer; then pasting the LED chip on the upper surface of the adhesive glue; and finally curing it. In this solution, the LED chips are pasted and fixed on the upper surface of the substrate through simple steps, and the light efficiency is high. On the other hand, the substrate weakens the luminous flux of the LED chip to absorb reflected light and reduces the temperature rise of the LED chip.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a structure of an LED lighting module and a manufacturing process thereof. Background technique [0002] The rapid development of LED has led to its increasingly popular application in the lighting field. A large number of LED light sources have been used in various traditional lighting fixtures / equipment to achieve light output, thus directly replacing traditional lamps without changing the electrical connection and geometric structure. , to obtain better light color performance and service life. [0003] Compared with traditional light sources, LED light sources have unique characteristics. In addition to the advantages of high luminous efficiency, good color rendering, and low temperature rise, they also have their obvious defects. The more obvious point is that the single luminous body of the LED light source is small in size and high in luminous density. If it is necessary to ob...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/62H01L33/64
CPCH01L33/64H01L33/46
Inventor 吴鼎鼎
Owner 莆田康布斯光电科技有限公司
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