Circuit board and circuit board manufacturing method

Abstract

The invention relates to a circuit board, which comprises a substrate, a first conductive line layer, a second conductive line layer, a first covering film and solder resist ink, wherein the first conductive line layer and the second conductive line layer are arranged at two opposite sides of the substrate; the second conductive line layer is provided with a connection area; the connection area is internally distributed with multiple electrical contact pads; the first conductive line layer comprises multiple first conductive lines; multiple gaps exist between the first conductive line layer and the first conductive lines in the region corresponding to the connection area; the first covering film covers the first conductive line layer; the region in the connection area corresponding to the first covering film is provided with multiple openings; the first openings and the gaps are in one-to-one correspondence so as to enable corresponding gaps to be exposed; and the solder resist ink fills the multiple first openings and the multiple gaps. The invention also relates to a circuit board manufacturing method.

Description

technical field [0001] The invention relates to a circuit board manufacturing technology, in particular to a circuit board and a circuit board manufacturing method. Background technique [0002] With the gradual thinning of electronic products, the application of directly mounting chips on circuit boards has gradually increased. Usually, there is a gap between the conductive lines on the back side of the electrical contact pads for wire bonding, which is easy to cause a break when the cover film is pressed, so that some of the electrical connection pads are recessed after pressing, so that the When the chip is mounted by wire, a wire break occurs in the recess, which affects the electrical connection between the chip and the circuit board. SUMMARY OF THE INVENTION [0003] In view of this, it is necessary to provide a circuit board and a manufacturing method of the circuit board. [0004] A circuit board includes a substrate, a first conductive circuit layer, a second co...

AI Technical Summary

Problems solved by technology

Usually there is a gap between the conductive lines on the opposite side of the electrical contact pads used for wire bonding, which is easy to cause a gap when the cover film is pressed, so that part of the electrical connection pads are sunken after pressing, so that when punching When the chip is mounted on the wire, a disconnection occurs at the recess, which affects the electrical connection between the chip and the circuit board

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