Water-cooled dual-refrigeration type semiconductor cold accumulation insulation box

Abstract

The invention provides a water-cooled dual-refrigeration type semiconductor cold accumulation insulation box, relates to a water-cooled semiconductor insulation box and aims at solving the problems of low refrigeration efficiency, short constant temperature time and restriction to popularization and application due to poor hot end heat dissipation effect of air cooling on the hot end of the semiconductor chilling plate of the existing insulation box. A thermal insulating material interlayer is arranged between the inner shell and the outer shell of the water-cooled dual-refrigeration type semiconductor cold accumulation insulation box; copper pipes are arranged on the four sides of the inner shell; each copper pipe is filled with a nano composite phase-change cold accumulation medium; a semiconductor overlaid chilling plate is mounted in the middle of a separator, and comprises a plurality of chilling plate groups; every two of the chilling plate groups are arranged up and down; a water cooling head is erected on the outer side of the semiconductor overlaid chilling plate; a heat transfer aluminum block is arranged to penetrate through the inner side of the semiconductor overlaid chilling plate; a fan is arranged at the air supply outlet of a semiconductor refrigeration system and connected with the left sidewall of the inner shell by use of an air pipe; the water cooling head is connected with a water pump and a cooling water bar by use of water pipes. The water-cooled dual-refrigeration type semiconductor cold accumulation insulation box is high in refrigeration efficiency, long in constant temperature time and convenient to popularize and utilize.

Description

technical field [0001] The invention relates to a water-cooled semiconductor heat preservation box, in particular to a water-cooled double-refrigeration type semiconductor cold storage heat preservation box. Background technique [0002] With the continuous improvement of people's living standards in our country, people's requirements for health are getting higher and higher. Perishable foods are prone to spoilage and deterioration at room temperature. Certain vaccines and enzymes used for first aid must be stored at low temperature, otherwise they will Failure occurs, so the freezing and refrigerating preservation of food and medicine has become a problem that people pay more and more attention to. The hot end of the semiconductor refrigeration and incubator commonly used in the market is often air-cooled. Since the hot end of the semiconductor refrigeration sheet is air-cooled, the heat dissipation effect of the hot end is poor, resulting in low cooling efficiency. After p...

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Problems solved by technology

[0003] The present invention solves the problem that the hot end of the semiconductor refrigerating sheet of the existing incubator is cooled by air, and the heat dissipation effect of the hot end is poor, resulting in low cooling efficiency and s

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