LED steady-state test method
A test method and LED lamp bead technology, which is applied in the direction of semiconductor/solid-state device testing/measurement, electrical measurement, and measuring devices, etc., can solve the problems of insufficient thermal resistance barriers, rising lamp bead junction temperature, and the existence of transient photoelectric parameters. Differences and other issues, to achieve high efficiency, save time, and simple operation
Inactive Publication Date: 2015-06-10
宁波高新区零零七工业设计有限公司
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Problems solved by technology
In the LED lighting industry, aluminum substrates can be seen everywhere in LED lamps. They play two major roles in heat transfer and connection circuits. Bottom thermal resistance, solid layer thermal resistance and other multi-level thermal resistance barriers make the lamp bead junction temperature rise in LED applications
In the LED package, the transient test is used, and the thermal resistance barrier is not obvious enough. In the LED application, the thermal resistance barrier is obvious when the steady-state test is used, resulting in the steady-state photoelectric parameters in the LED application and it in the LED package. There are differences in transient photoelectric parameters
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[0011] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0012] refer to figure 1 , the specific embodiment adopts the following technical solutions: a LED steady-state test device: including a temperature-sensitive line 1, a heating rod 2, a test fixture 3 and a temperature controller 4; one end of the temperature-sensitive line 1 is connected to the base 3 of the test fixture 3 -1 bottom, the other end is connected to the temperature controller 4; the heating rod 2 is connected to the base 3-1 and the temperature controller 4;
[0013] It is worth noting that the LED steady-state test steps are as follows: set the temperature of the temperature controller 4, the heating rod 2 heats the bottom of the base 3-1 of the test fixture 3, and the temperature-sensitive line 1 senses the temperature of the test...
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The invention discloses an LED steady-state test method, and relates to the technical field of packaging of LED devices. The method includes a temperature sensing line, a heating bar, a testing clamp and a temperature control instrument; one end of the temperature sensing line is connected to the bottom part of a base of the test clamp, and while the other end of the temperature sensing line is connected with the temperature control instrument; the heating bar is connected with the base and the temperature control instrument; one end of the temperature sensing line and one end of the heating bar are arranged in a testing clamp cavity. According to the method, the steady state of a lamp in LED application is simulated by external heating, and the problems in the background technology can be effectively solved; the steady-state test is simple to operate and can be performed by directly externally heating, so that the efficiency is high, and the time can be saved.
Description
technical field [0001] The invention relates to the technical field of light-emitting diode device packaging, in particular to an LED steady-state testing method. Background technique [0002] Due to the characteristics of high luminous efficiency, low power consumption, and no pollution, LED light source devices are being widely used in TV backlights, graphic display screens, decorative lighting and other fields. In the LED lighting industry, aluminum substrates can be seen everywhere in LED lamps. They play two major roles in heat transfer and connection circuits. The multi-level thermal resistance barriers such as the thermal resistance of the bottom and the thermal resistance of the die-bonding layer increase the junction temperature of the lamp bead in LED applications. In the LED package, the transient test is used, and the thermal resistance barrier is not obvious enough. In the LED application, the thermal resistance barrier is obvious when the steady-state test is ...
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IPC IPC(8): H01L21/66
CPCG01R31/2601G01R31/2644
Inventor 赵东奇
Owner 宁波高新区零零七工业设计有限公司