Liquid supplying apparatus

A technology for liquid supply and liquid treatment, applied in liquid injection devices, devices for coating liquid on surfaces, spray devices, etc., to achieve the effects of reducing pressure loss, suppressing pollution, and suppressing complications

Inactive Publication Date: 2015-06-17
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these Patent Documents 1 and 2, there is no problem when discharging a high-viscosity treatment liquid.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0176] First, using a wafer W having a diameter of, for example, 450 mm, the discharge amount of the resist solution is varied to various values, and the extent to which the resist solution spreads on the wafer W is measured. Specifically, the wafer W is rotated around a vertical axis at an arbitrary rotational speed, the resist liquid is discharged from the center of the wafer W, and the resist liquid (resist film) diffused in a circular shape on the wafer W is measured. ) radius size.

[0177] The result is as Figure 25 As shown, when the rotation speed of the wafer W is 600 rpm, when 15 g of the resist liquid is discharged, the resist liquid spreads into a circle with a radius of 150 mm. Accordingly, it can be seen that about 15 g of the resist solution is sufficient to coat the entire surface of the wafer W having a diameter of 300 mm. On the other hand, in order to apply a resist solution to the entire surface of a wafer W with a diameter of 450 mm, a resist solution w...

experiment example 2

[0179] Next, an experiment was conducted to confirm the relationship between the liquid supply pressure of the resist liquid and the discharge amount of the resist liquid when the resist liquid was stored on the side of the cassette and the cassette was pressurized to discharge the resist liquid. related relationship. The result is as Figure 26 As shown, it can be seen that the above-mentioned pressure has an extremely high correlation with the discharge amount of the resist solution. In addition, when the pressure of the cartridge is set to an arbitrary value, similarly confirming the correlation between the discharge time for discharging the resist liquid and the discharge amount of the resist liquid, it is obtained that Figure 27 The results shown. Also from this result, it can be seen that the discharge time of the resist solution has an extremely high correlation with the discharge amount of the resist solution.

experiment example 3

[0181] An experiment was conducted to confirm the effect of the discharge time of the resist solution on the resist film when the resist solution was discharged to the wafer W. FIG. As a result, when the resist solution was discharged at an extremely slow discharge rate of 0.08 ml / sec (discharge time: about 400 seconds), as Figure 28 As shown in "Experiment 3-1" of , a difference in film thickness occurs within the plane of the wafer W. On the other hand, when the above-mentioned discharge time is set to a short time of about 20 seconds, as Figure 28 As shown in "Experiment 3-2", a uniform film thickness can be obtained in side view. That is, it can be considered that if the discharge speed of the resist liquid is set to be slow, in other words, if a long time interval occurs between the start of the discharge of the resist liquid and the end of the discharge, the resist will Before the discharge of the liquid is completed, the discharged resist liquid may dry and harden. ...

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PUM

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Abstract

An embodiment of a liquid supplying apparatus for supplying a processing liquid to a process object includes: a processing liquid cartridge including: a reservoir chamber for storing the processing liquid; an ejecting port for ejecting the processing liquid stored in the reservoir chamber; a pusher unit for pushing the processing liquid stored in the reservoir chamber outward through the ejecting port; and a replenishing port for replenishing the processing liquid into the reservoir chamber; a standby unit having a standby area where the processing liquid cartridge is standing-by; a transport mechanism that transports the processing liquid cartridge between the standby unit and a location where the processing liquid cartridge supplies the processing liquid to the process object; and an actuating mechanism provided in the transport mechanism that drives the pusher unit to push the processing liquid stored in the reservoir chamber.

Description

technical field [0001] The present invention relates to a liquid supply device for supplying a treatment liquid to an object to be treated. Background technique [0002] In a series of processes for manufacturing semiconductor devices, the process of supplying processing liquids such as diluents, resist liquids, polyimides, and adhesives to semiconductor wafers (hereinafter referred to as "wafers") as substrates (objects to be processed) process. The higher the viscosity of the processing liquid, the more difficult it is to discharge, and the amount of processing liquid required to cover the surface of the wafer increases as the diameter of the wafer increases. Quickly eliminate existing needs. [0003] However, in order to increase the discharge rate of the treatment liquid, for example, if a large-capacity pump is provided, the cost of the device will increase, and if the inner diameter of the pipe through which the treatment liquid flows is increased, the piping will be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10B05C11/11
CPCH01L21/6715B05B15/55B05B9/03B05B12/081
Inventor 船越秀朗久保田稔
Owner TOKYO ELECTRON LTD
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