Backplate electrode sensor

A sensor and sensor electrode technology, applied in the field of sensors, can solve problems such as adding

Inactive Publication Date: 2015-06-17
IDC LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, incorporating such additional sensing components, such as accelerometers or pressure sensors, adds cost and complexity to the device and represents a tradeoff between added functionality and added cost

Method used

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  • Backplate electrode sensor
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Embodiment Construction

[0037] The following description is directed to certain embodiments for the purpose of describing the innovative aspects of the invention. However, those skilled in the art will readily recognize that the teachings herein can be applied in many different ways. The described embodiments can be implemented in any device, apparatus, or system that can be configured to display an image, whether in motion (e.g., video) or stationary (e.g., still image), and whether the image is text , graphic or pictorial. Rather, it is contemplated that the described implementations may be included in or associated with a variety of electronic devices such as, but not limited to, a mobile phone , cellular phones with multimedia Internet capabilities, mobile television receivers, wireless devices, smart phones, Devices, Personal Data Assistants (PDAs), Wireless Email Receivers, Handheld or Laptop Computers, Netbooks, Notebook Computers, Smart Notebook Computers, Tablet Computers, Printers, Copie...

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Abstract

This disclosure provides systems, methods and apparatus for electromechanical systems (EMS) device packages having integrated sensors. In one aspect, electrodes within a packaged EMS device can be used in conjunction with an electrode disposed on another substrate within the EMS device package to form one or more capacitive sensors. The capacitive sensor may be used to determine the relative deformation of substrates within the EMS device package, which can in turn be used as part of a pressure, touch, mass, or impact measuring system.

Description

technical field [0001] The present invention relates to electromechanical systems (EMS) device packages and sensors that can be integrated into EMS device packages. Background technique [0002] Electromechanical systems (EMS) include devices with electrical and mechanical elements, actuators, transducers, sensors, optical components such as mirrors and optical films, and electronics. EMS devices or elements can be fabricated on a variety of scales, including but not limited to microscale and nanoscale. For example, microelectromechanical systems (MEMS) devices may include structures ranging in size from about one micron to hundreds of microns or more. Nanoelectromechanical systems (NEMS) devices can include structures with sizes smaller than a micron, including, for example, sizes smaller than hundreds of nanometers. Electromechanical elements may be formed using deposition, etching, photolithography, and / or other micromachining processes that etch away portions of substr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02G01D5/241
CPCB81B7/02B81B2201/047G01D5/2417G01G7/06G01L1/146G01L5/0052G01L9/0072G01P15/0891G01P15/125G02B26/001G06F3/0445G06F3/0446G06F3/0447G09G3/3466Y10T29/49117G06F3/017G06F3/0412G06F3/0488
Inventor 詹姆斯·C·米多尔伊戈尔·切尔特夫
Owner IDC LLC
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