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Deposition of non-isostructural layers for flexible substrate

A non-isomorphic, substrate technology, applied in the direction of coating, metal material coating process, thin material processing, etc., can solve problems such as performance degradation and shortening of life.

Inactive Publication Date: 2015-06-24
威科ALD有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Such cracks can propagate and cause the flexible substrate or devices formed thereon to suffer from shortened lifetime and degraded performance

Method used

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  • Deposition of non-isostructural layers for flexible substrate
  • Deposition of non-isostructural layers for flexible substrate
  • Deposition of non-isostructural layers for flexible substrate

Examples

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Embodiment Construction

[0018] Embodiments are described herein with reference to the accompanying drawings. However, the principles disclosed herein may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. In the specification, well-known features and technical details may be omitted to avoid unnecessarily obscuring characteristics of the embodiments.

[0019] In the drawings, the same reference numerals denote the same elements throughout the drawings. Shapes, sizes, regions, etc. in the drawings may be exaggerated for clarity.

[0020] Embodiments relate to forming a non-isomorphic layer of material on a substrate by using atomic layer deposition (ALD) or molecular layer deposition (MLD). The non-isomorphic layer includes one or more inorganic materials (e.g., Al 2 o 3 ) layer and one or more layers of hydrocarbon-containing material. A layer of hydrocarbon-containing material may be disposed between layers of inorganic material to...

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Abstract

A plurality of non-isostructural layers are deposited onto a substrate. An inorganic layer is deposited onto the substrate by adsorbing metal atoms to the substrate. The inorganic layer on the substrate is exposed to a hydrocarbon-containing source precursor to deposit a first hydrocarbon-containing layer by adsorbing the hydrocarbon-containing source precursor onto the inorganic layer. The first hydrocarbon-containing layer on the substrate is exposed to a reactant precursor to increase reactivity of the first hydrocarbon-containing layer on the substrate, and a second hydrocarbon-containing layer is deposited onto the first hydrocarbon-containing layer on the substrate. The process may be repeated to deposit the plurality of layers. The second hydrocarbon-containing layer may have higher hydrocarbon content and may be deposited at a higher deposition rate than the first hydrocarbon-containing layer.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Patent Application No. 61 / 913,686, filed December 9, 2013, and U.S. Utility Patent Application No. 14 / 561,513, filed December 5, 2014, the entire contents of which are incorporated herein by reference . technical field [0003] The present disclosure relates to the deposition of multiple layers ("multilayers") of non-isomorphic materials on a substrate for packaging. Background technique [0004] Flexible substrates are employed in various electronic devices such as organic light emitting diode (OLED) devices and other display devices. Such devices include flexible substrates on which are disposed multiple layers of devices, organic layers, and inorganic layers. One or more layers of organic and / or inorganic layers may be formed to surround the device or other layers to prevent environmental substances from contacting the device or other active components. By p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/44
CPCC23C16/45529C23C16/22Y10T428/2495Y10T428/31663H10K71/00H10K59/00Y02E10/549C23C16/45525
Inventor 李相忍黄敞玩
Owner 威科ALD有限公司
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