Interface defect detection method and interface defect detection device of metal-dielectric medium thin-layer bonding or coating structure

Abstract

The invention provides an interface defect detection method of a metal-dielectric medium thin-layer bonding or coating structure. The method comprises the following steps: a certain electric field is applied to the two sides of a sample to be tested; parts with defects on the sample to be tested firstly have a partial discharging phenomenon; and whether the sample to be tested has the defects or not by monitoring a discharging signal can be judged, and defect positioning can be carried out. An interface defect detection device of the metal-dielectric medium thin-layer bonding or coating structure comprises a high-voltage electrode with an adjustable high-voltage generator; a metal surface of the sample to be tested is tightly fitted with the high-voltage electrode; a partial discharging monitoring system is electrically connected with the high-voltage electrode and is used for detecting a defect discharging signal from a high-voltage side; and a grounding electrode is tightly fitted with a non-metal surface of the sample to be tested. According to the interface defect detection method and an interface defect detection device of the metal-dielectric medium thin-layer bonding or coating structure, the problem that interface defects of a thin-layer structure are difficult to detect can be solved; and the detection reliability is relatively high, and electric and mechanical performances of the test sample are not influenced or damaged.

Description

technical field [0001] The invention relates to the field of non-destructive testing, in particular to a method and device for detecting interface defects of metal-dielectric thin-layer bonding or coating structures. Background technique [0002] A bonded structure is a solid structure formed by direct crimping or bonding of two different substances or materials. At present, thin-layer bonded structures are widely used in various fields such as chemical industry, aviation, aerospace and food. However, defects such as pores, debonding, and delamination damage often occur during its manufacture and use. The existence of these defects not only causes the reduction of structural strength and stiffness, but also degrades the mechanical properties of the structure under the action of external forces and may lead to structural damage. total failure. [0003] The coating material widely used in engineering refers to a thin layer of material that is coated (plated) on the surface o...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method and device for detecting interface defects of metal-dielectric thin-layer bonding or coating structures, which can solve the problem of difficult detection of interface defects of thin-layer structures or coatings, and improve the reliability of detection. Higher, and will not affect or damage the electrical and mechanical properties of the sample

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