Radio-frequency vertical transformation circuit based on fuzz button

Abstract

The invention provides a radio-frequency vertical transformation circuit based on a fuzz button. The radio-frequency vertical transformation circuit comprises circuit wafers, a metal structure piece and a similar coaxial connector. The circuit wafers include the upper circuit wafer and the lower circuit wafer which are arranged at the upper end and the lower end of the metal structure piece respectively, are in electrical contact with the upper end and the lower end of the metal structure piece respectively and are the same in structure, and inputting and outputting of radio frequency signals are achieved. The similar coaxial connector is embedded into the metal structure piece, and the upper circuit wafer is in vertical circuit connection with the lower circuit wafer. The similar coaxial connector comprises an outer ring insulating layer and an internal vertical connecting circuit. The internal vertical connecting circuit comprises a fuzz button end and a fixed cap end which are electrically connected. Compared with the prior art, the radio-frequency vertical transformation circuit is simple in structure, excellent in performance, high in reliability and convenient to install; the structural mode of being matched with the fixed cap end is adopted to the similar coaxial connector based on the fuzz button, it can be guaranteed that the fuzz button can not be pressed to overflow at the fixed cap end, and therefore the reliability of the whole vertical transformation circuit is improved.

Description

technical field [0001] The invention relates to a fur button-based radio frequency vertical conversion circuit, in particular to a fur button-based radio frequency vertical conversion circuit suitable for the microwave technology field. Background technique [0002] With the continuous improvement of the integration density of electronic equipment such as radar and communication, they have higher and higher requirements on the volume of microwave components. Microwave components are gradually developing from traditional two-dimensional plane integration to three-dimensional integration. The key difficulty in three-dimensional microwave components is to realize the vertical interconnection between two-dimensional multi-chip microwave circuit modules, that is, to realize the high-performance transmission of radio frequency signals between layer and layer circuits in the vertical direction. [0003] The vertical interconnects commonly used in 3D microwave components are mainly ...

AI Technical Summary

Problems solved by technology

BGA is vertically interconnected by planting balls on the surface of the circuit chip, but the reliability of this method is low, and it is easy to cause defects such as solder accumulation or voids, which will affect the microwave transmission performance

The elastic connector based on the fur button can realize elastic crimping connection, but the uncertainty of the deformation of the fur button after being squeezed may cause the fur button to overflow the dielectric support, affecting its microwave transmission performance, and the fur button is easy to assemble. Slipping, affecting assembly efficiency

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