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A kind of tsv silicon chip pre-alignment device and method thereof

A pre-alignment, silicon wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as low pre-alignment accuracy, inability to realize automated operations, and pre-alignment accuracy susceptible to human interference, etc. achieve the effect of improving accuracy

Active Publication Date: 2017-12-29
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a TSV silicon chip pre-alignment device and its method to solve the problem of low efficiency, low pre-alignment accuracy, human-interferenced pre-alignment accuracy and inability to realize automatic operation in the existing TSV silicon chip pre-alignment method. question

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  • A kind of tsv silicon chip pre-alignment device and method thereof
  • A kind of tsv silicon chip pre-alignment device and method thereof
  • A kind of tsv silicon chip pre-alignment device and method thereof

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Embodiment Construction

[0052]In order to describe the technical solution of the above invention in more detail, specific examples are listed below to demonstrate the technical effect; it should be emphasized that these examples are used to illustrate the present invention and not limit the scope of the present invention.

[0053] The TSV silicon wafer pre-alignment device provided by the present invention, such as Figure 1 to Figure 9 As shown, it includes a light source 10, an image sensor (preferably, a CCD image sensor 20), a first device 40, and a second device 50. The first device 40 makes the TSV silicon wafer rotate and lift, and the second device 50 Translate the TSV wafer. Preferably, the light source 10 is a point light source. The CCD image sensor 20 collects the light signal reflected by the light source 10 from the TSV silicon wafer 60, and the first device 40 and the second device 50 complete the centering and positioning of the TSV silicon wafer 60 according to the light signal. Or...

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Abstract

The invention relates to a device and a method for pre-aligning a TSV (Through Silicon Via) silicon chip. The device comprises a light source, an image sensor, a first device for rotating and lifting the TSV silicon chip, and a second device for translating the TSV silicon chip, wherein the image sensor is used for acquiring light signals reflected by the light source from the TSV silicon chip; the first device and the second device are used for performing centering and directional adjusting for the TSV silicon chip according the light signal. According to the device, the light signal acquired by the image sensor is utilized to compensate the eccentric magnitude and deviation magnitude of the TSV chip, so that the pre-aligning precision of the TSV silicon chip can be improved, and meanwhile, the working efficiency is increased, and automatic work can be performed.

Description

technical field [0001] The invention relates to the field of semiconductor microelectronics, in particular to a TSV silicon chip pre-alignment device and a method thereof. Background technique [0002] TSV (Through Silicon Via Technology) is the latest technology to realize the interconnection between chips by making vertical conduction between chips and between wafers. It has small package size, fast signal transmission and low power consumption. Etc. [0003] After the standard silicon wafer has gone through various TSV processes, the edge of the silicon wafer shows: inconsistent bonding, non-concentricity; wear on the edge; line grooves; sputtered metal or insulating glue on the surface of the silicon wafer; warping of the silicon wafer. Silicon chip gaps are manifested as: the gap does not penetrate, is damaged, is filled or covered by metal or glue, and has metal lines. Due to the drastic deterioration of the shape of the silicon wafer gap, Aligner is used in the worl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68
CPCH01L21/681
Inventor 孙伟旺黄春霞
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD