Packaged interlayer antenna capable of seam phase calibration

Abstract

The invention discloses a package interlayer antenna capable of seam phase calibration and relates to a horn antenna. The antenna comprises a micro-strip feeder line (1), a horn antenna (2) and seams (3), which are integrated on a medium substrate (4), the medium substrate (4) is arranged on an inner layer of a three-dimensional package (5), one end of the microstrip feeder line (1) is connected with an internal circuit (8) via a coplanar waveguide (7) on the side of the package, the horn antenna (2) is composed of a bottom metal plane (9), a top metal plane (10) and a metallized via hole side wall (11), a plurality of seams (3) are arranged in the bottom metal plane (9) and the top metal plane (10), and several sub-horns (16) are formed in the horn antenna (2) by the seams (3), one ends of the seams (3) face the micro-strip feeder line (1), and the other ends of the seams (3) are arranged on an antenna aperture surface (12). Electromagnetic wave energy in the antenna can reach the antenna aperture surface (12) by the same phase. By the antenna, antenna aperture efficiency and gains can be improved.

Description

Technical field [0001] The invention relates to a horn antenna, in particular to a packaged sandwich antenna with slot phase calibration. Background technique [0002] Using the stacked three-dimensional multi-chip (3D-MCM) technology, a radio frequency system can be integrated in a three-dimensional stacked package, for which it is also necessary to integrate the antenna on the package. The antenna is usually integrated on the surface of the package, for example, the patch antenna is integrated on the top of the package. But sometimes it is necessary to integrate the antenna in a mezzanine in the middle of the package to meet the needs of the system. If the horn antenna is integrated in the interlayer inside the package, the above requirements can be achieved. However, usually horn antennas are non-planar, are incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, substrate-int...

AI Technical Summary

Problems solved by technology

However, the horn antenna is usually non-planar, incompatible with the planar circuit process, and has a large geometric size, which limits its application in the packaging structure

In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The reason is that the horn The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the electric field intensity of the aperture is uneven, and the radiation directivity and gain decrease

At present, methods such as dielectric loading and dielectric prism have been used to correct the asynchronous phase of the horn aperture surface, but these phase alignment structures increase the overall structural size of the antenna and are not suitable for integration into the interlayer inside the package.

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