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Particle free rotary target and method of manufacturing thereof

A technology of target material and sputtering target, which is applied in the field of particle-free rotatable target material and its manufacturing, and can solve problems such as damage to the quality of deposition process

Inactive Publication Date: 2015-07-01
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition to the generation of particles that may impair the quality of the deposition process, methods such as clean sputtering of the target may also result in reduced target consumption or at least desired target consumption
Again, this situation creates a tendency not to fully use the target material to the maximum extent

Method used

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  • Particle free rotary target and method of manufacturing thereof
  • Particle free rotary target and method of manufacturing thereof
  • Particle free rotary target and method of manufacturing thereof

Examples

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Embodiment Construction

[0026] Reference will now be made in detail to several embodiments of the invention, examples of one or more of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same elements. In general, only the differences from the respective embodiments are described. Each example is provided by way of illustration of the invention, and is not intended as a limitation of the invention. Furthermore, features illustrated or described as part of one embodiment can be used on or in combination with other embodiments to yield yet a further embodiment. This description includes such modifications or variations as are contemplated.

[0027] Again, in the following description reference is made to target segments of rotatable targets. It is understandable that a target segment may also refer to a tile or a target sheet. Accordingly, the one or more targets, for example four to eight, or even more targets,...

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Abstract

A rotatable sputter target configured for rotation around an axis defining an axial direction is described. The rotatable sputter target includes at least a first target segment and a second target segment forming a target, wherein at least one of opposing side surfaces of the first target segment and the second target segment are roughened, particularly to a surface roughness of 10 μm Rmax or above, more particularly of 100 μm Rmax or above

Description

technical field [0001] Embodiments of the present invention relate to rotatable sputtering targets and rotatable sputtering cathodes. Embodiments of the invention relate in particular to rotatable sputtering targets and rotatable sputtering cathodes, wherein two or more segments are provided to form the target. In particular, they relate to rotatable sputtering targets arranged to rotate about an axis, rotatable sputtering cathodes and methods of manufacturing rotatable sputtering cathodes, the axis defining an axial direction. Background technique [0002] In many applications it is necessary to deposit thin layers on substrates. Known techniques for depositing thin layers are in particular evaporation, chemical vapor sputtering and sputter deposition. For example, sputtering can be used to deposit thin layers, such as ceramics. During the sputtering process, the coating material is transported from the sputtering target, which the sputtering target consists of, to the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
CPCH01J37/3414H01J37/3417C23C14/3407Y10T29/49117H01J37/3426H01J37/3435H01J37/3491
Inventor A·霍斯卡瓦
Owner APPLIED MATERIALS INC