Novel riveting machine platform and printed circuit board laminating method applying the same
A riveting machine and countertop technology, applied in printed circuit, printed circuit manufacturing, multi-layer circuit manufacturing, etc., can solve problems such as low alignment accuracy, difficult alignment, and influence on normal production, so as to expand the scope of application and reduce production Cost, the effect of improving alignment accuracy
Inactive Publication Date: 2015-07-22
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
[0004] For this reason, the technical problem to be solved by the present invention is that the existing rivet machine table adopts a unilateral positioning method, which has low alignment accuracy and is difficult to align under special process conditions, and the core board is easy to shift, affecting normal production, thereby Propose a new type of riveting machine table with accurate alignment, simple operation and wider application range and a lamination method for printed circuit boards using this table
Method used
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Embodiment
[0029] This embodiment provides a novel riveting machine table, such as Figure 2-4 As shown, it includes a table body 1, three first positioning holes 2 uniformly arranged along one side of the table body 1, and a positioning groove 3 is arranged on the opposite side of the first positioning hole 2, and the positioning groove 3 A positioning base is provided, and the positioning base can slide in the positioning groove, and a second positioning hole 4 is provided on the positioning base, the aperture of the first positioning hole 2 is 3.175mm, and the second positioning hole 4 The aperture is 3.175; the first positioning hole 2 and the second positioning hole 4 are equipped with positioning pins; the positioning groove 3 is arranged perpendicular to the long side of the table body 1 and is located at the length of the table body 1 The middle position in the direction, its size is: length 350mm, width 22mm, the distance between the short side distance of the positioning groove...
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Abstract
The invention discloses a novel riveting machine platform. The novel riveting machine platform comprises a platform body, a plurality of first positioning holes are uniformly arranged in one side of the platform body, the opposite sides of the first positioning holes are provided with positioning grooves, and positioning bases are arranged in the positioning grooves, can slide in the positioning grooves and are provided with second positioning holes. The technical problem that an existing riveting machine platform in the prior art is inaccurate in positioning is solved, and alignment accuracy of a core plate and a prepreg is greatly improved. In addition, the second positioning bases can slide in the positioning grooves, requirements of different sizes of core plates are met, trouble to manufacture different riveting machine platforms for different types of printed circuit boards is avoided, production cost of printed circuit boards is reduced, and application range of the riveting machine platform is enlarged.
Description
technical field [0001] The invention belongs to the field of mechanical processing, and in particular relates to a printed circuit board riveting table and a printed circuit board manufacturing method using the same. Background technique [0002] Multilayer printed circuit board refers to a circuit board made of hard and soft printed circuit boards alternately put together and pressed together. The positioning method between layers of multilayer printed circuit boards in the process of lamination can be divided into pins Positioning lamination process (PIN-LAN) and pinless positioning lamination process (MASS-LAM), the former has high positioning accuracy, but low efficiency and high cost, and is only suitable for the production of high-layer, high-precision multilayer printed circuit boards , the latter has high efficiency and low cost, and is currently the production method adopted by most manufacturers. [0003] The process flow of pinless positioning lamination is as fo...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/46B21J15/14
CPCB21J15/14H05K3/4638H05K2203/166
Inventor 邓辉喻恩梁保山
Owner SHENZHEN SUNTAK MULTILAYER PCB