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Composite micro-electromechanical system chip and manufacturing method thereof

A technology of a micro-electromechanical system and a manufacturing method, which is applied to parts of a TV system, generators/motors, TVs, etc., can solve the problems of complicated etching control and the like

Inactive Publication Date: 2015-07-29
RICHTEK TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in this prior art, etching grooves with different etching depths need to be formed, which is complicated for etching control and difficult to perform precisely and consistently.

Method used

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  • Composite micro-electromechanical system chip and manufacturing method thereof
  • Composite micro-electromechanical system chip and manufacturing method thereof
  • Composite micro-electromechanical system chip and manufacturing method thereof

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Embodiment Construction

[0025] The foregoing and other technical content, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment in conjunction with the accompanying drawings. Directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only the directions with reference to the drawings. The drawings in the present invention are all schematic, and are mainly intended to show the functional relationship between each device and each component. As for the shape, thickness, and width, they are not drawn to scale.

[0026] figure 1 A cross-sectional view of a composite MEMS chip according to an embodiment of the invention is shown. The composite MEMS chip includes a cover wafer 100 and a component wafer 200 that are combined with each other, and a first chamber 120A and a second chamber 120B with different operating pressures are formed (the cover wafer 100 and the comp...

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Abstract

The invention provides a composite micro-electromechanical system chip and a manufacturing method thereof. The composite micro-electromechanical system chip comprises a covering layer and an assembly composite layer, and the covering layer comprises a substrate, wherein the substrate comprises a first area and a second area, the first area has a plurality of first etching baths, the second area has a plurality of second etching baths, each of the first etching baths has a same etching depth with each of the second etching baths, and the first etched pattern density of the first area is higher than the second etched pattern density of the second area in order to form cavities with different pressures.

Description

【Technical Field】 [0001] The present invention relates to a Micro-Electron-Mechanical System (MEMS) chip and a manufacturing method thereof, and in particular to a method capable of using different etch pattern densities covering different areas of a wafer, correspondingly A composite microelectromechanical system chip that generates different pressures in different chambers of a microelectromechanical system chip and a manufacturing method thereof. 【Background technique】 [0002] In the MEMS chip manufacturing process, internal MEMS components, such as micro-acoustic pressure sensors, gyroscopes, accelerometers, etc., often need to be fabricated in a closed space to maintain their stability. The operation pressure of MEMS components with different application functions in this enclosed space is also different. For example, the MEMS component of a gyroscope is usually operated at an operating pressure of 0.1-10 mbar; and the MEMS component of an accelerometer is usually operated...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81B7/02
Inventor 康育辅罗炯成
Owner RICHTEK TECH