Wafer scanning and cleaning swing arm device

A technology of wafer and swing arm shaft, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of cleaning dead angle and poor cleaning effect, and achieve the advantages of reducing electrical connections, large reduction ratio, and enhancing independence Effect

Active Publication Date: 2015-07-29
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a wafer scanning and cleaning swing arm device. The technical problem to be solved is that the swing arm device of the tradit...

Method used

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  • Wafer scanning and cleaning swing arm device
  • Wafer scanning and cleaning swing arm device
  • Wafer scanning and cleaning swing arm device

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Embodiment Construction

[0055] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0056] The embodiment of the present invention needs to solve the problem that the swing arm device of the traditional wafer cleaning device only has the scanning and swinging function, the cleaning effect is poor when cleaning the wafer, and there may be cleaning dead spots.

[0057] Such as image 3 As shown, it is a side view of a wafer scanning and cleaning swing arm device provided by an embodiment of the present invention. The wafer scanning cleaning swing arm device includes:

[0058] A swing arm part 100, the swing arm part is provided with a swing arm shaft 17;

[0059] Nozzle 19, the nozzle 19 is installed on the swing arm part 100, and can rotate around the swing arm part 100;

[0060] The lifting part 2...

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Abstract

The invention relates to a wafer scanning and cleaning swing arm device. The wafer scanning and cleaning swing arm device comprises a swing arm part, a nozzle, a lifting part, a swing part and a shell, wherein the swing arm part is provided with a swing arm shaft, the nozzle is mounted on the swing arm part and can rotate around the swing arm part, the lifting part is used for driving the swing arm part to move along the vertical direction, the swing part is used for driving the swing arm shaft of the swing arm part to rotate, and the shell is used for mounting the swing arm part, the lifting part and the swing part. The nozzle is mounted on the swing arm part and can rotate round the swing arm part, so that spraying angle of the nozzle to wafers can be conveniently adjusted; by the aid of the swing part, the swing arm shaft of the swing arm part is driven to rotate, and scanning swing of the swing arm part is realized. By the lifting part, the swing arm part is driven to move along the vertical direction, so that the problems that wafer cleaning effect is poor and cleaning dead corners possibly exist due to the fact that a conventional swing arm part only swing to one direction for scanning are solved.

Description

technical field [0001] The invention belongs to the technical field of wafer cleaning in the process of semiconductor wafer processing, and in particular relates to a scanning cleaning swing arm device for cleaning the surface of the wafer. Background technique [0002] During the semiconductor wafer manufacturing process, the wafer needs to go through multiple cleaning steps. Due to the continuous reduction of critical dimensions of device process technology and the introduction of new materials, surface cleaning treatment in front end of line (FEOL) is more important. The shrinking of critical dimensions narrows the cleaning process window, making it increasingly difficult to meet wafer cleaning efficiency while minimizing wafer surface damage and structural damage. [0003] Wafer wet cleaning is divided into two methods: tank cleaning and single wafer cleaning. Single wafer cleaning can reduce the risk of cross-contamination during cleaning and improve yield. By using ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67051
Inventor 刘永进宋文超刘玉倩陈仲武姚立新
Owner THE 45TH RES INST OF CETC
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