Method of improving bonding reliability of semiconductor devices

A semiconductor and reliability technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as easy bonding failure of pads, and achieve the effect of improving bonding reliability and reducing costs

Active Publication Date: 2015-08-12
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for improving the bonding reliability of semiconductor devices, which is used to solve the problem that the bonding pads are prone to bonding failure after high-temperature screening tests in the prior art

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  • Method of improving bonding reliability of semiconductor devices
  • Method of improving bonding reliability of semiconductor devices
  • Method of improving bonding reliability of semiconductor devices

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Embodiment Construction

[0025] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0026] Please refer to attached picture. It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be change...

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Abstract

The invention provides a method of improving bonding reliability of semiconductor devices, comprising the steps of: firstly providing a semiconductor wafer after high temperature screening test, the semiconductor wafer comprising at least two semiconductor device units, wherein the surface of each semiconductor device unit forms a welding pad with residual particles; removing the residual particles on the welding pad by employing an etching process; and finally performing lead bonding on the surface of the welding pad. The method of the invention is provided with an etching step after high temperature screening test of the semiconductor wafer, is used for removing the residual particles on the surface of the welding pad, and guarantees flatness of the surface of the welding pad, thereby improving bonding reliability of semiconductor devices, and reducing cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor technology, in particular to a method for improving the bonding reliability of semiconductor devices. Background technique [0002] In the semiconductor manufacturing process, after completing the manufacturing process of the semiconductor device in the front stage and the metal interconnection structure manufacturing process in the back stage, it is necessary to form a pad on the top metal interconnection line; in the packaging process, the outer lead is directly bonded to the solder pads, or form solder bumps on the solder pads. Aluminum metal has the advantages of low resistivity, easy etching, and good adhesion with dielectric materials and metal materials, and is often used to make solder pads. Due to the simple aluminum process and low cost, aluminum metal is often used to make welding pads in the process of 65nm or even smaller technology nodes. However, due to the active chemical p...

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L2224/02166
Inventor 张楠生
Owner SEMICON MFG INT (SHANGHAI) CORP
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