Intelligent card chip handling device

Abstract

The present invention discloses an intelligent card chip handling device which comprises a frame, a chip adsorbing mechanism and a moving mechanism. The chip adsorbing mechanism comprises an adsorbing head, a vacuum device which is connected to the adsorbing head, and a mounting frame which is connected to the moving mechanism. The adsorbing head is connected to a turning mechanism which comprises a power mechanism, a hinge structure arranged between the adsorbing head and the mounting frame, a driving connection structure which is arranged between the power mechanism and the adsorbing head, and a spring which is connected between the adsorbing head and the mounting frame. The driving connection structure comprises a sliding groove arranged on the adsorbing head and a driving rod arranged on the power mechanism. The driving rod extends into the sliding groove. When the driving rod moves to two end points of a vertical stroke, the driving rod is at two ends of the sliding groove, and the working end faces of the adsorbing head are in horizontal and vertical states respectively. The intelligent card chip handling device has the advantages of simple structure, small size, high efficiency, and good positioning accuracy.

Description

technical field [0001] The invention relates to smart card manufacturing equipment, in particular to a smart card chip handling device. Background technique [0002] During the production process of the smart card, it is necessary to package the chip into the card. According to different working methods, the smart cards are divided into three types: contact smart cards, non-contact smart cards and dual-interface smart cards. Among them, when the contact smart card is working, the chip and the card reading device are in direct contact with each other to read and write data. Non-contact smart cards read and write data through wireless transmission (electromagnetic induction), while dual-interface smart cards can read and write data through direct contact or wireless transmission (electromagnetic induction). The working methods of the three are different, and there are also differences in the manufacturing process. The main difference is that when the dual-interface card is pa...

AI Technical Summary

Problems solved by technology

[0006] It can be seen that in the existing dual-interface smart card packaging equipment, the chip handling device is not only complex in structure and slow in speed, but also needs to be exchanged and turned over many times, the positioning accuracy is poor, and the problem of misalignment between the solder joints of the chip and the antenna is prone to occur. Affect welding quality

In addition, the existing dual-interface card chip packaging equipment can only be used for chip packaging of dual-interface cards, not suitable for chip packaging of contact smart cards

Images