Low temperature hermetic sealing via laser

A technology of laser and laser radiation, applied to electrical components, parallel glass structures, windows/doors, etc., can solve problems such as restrictions on the wide use of frits

Inactive Publication Date: 2015-08-12
GUARDIAN IND CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But so far, the widespread use of this type of frit has been limited

Method used

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  • Low temperature hermetic sealing via laser
  • Low temperature hermetic sealing via laser
  • Low temperature hermetic sealing via laser

Examples

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Embodiment Construction

[0030] Exemplary embodiments are described in detail herein with reference to the drawings, wherein like reference numerals denote like elements. It should be understood that the embodiments described herein are for illustration only, not limitation, and various modifications can be made by those skilled in the art without departing from the spirit and scope of the appended claims.

[0031] refer to image 3 , illustrating a partial cross-sectional view of a VIG unit and a sealing material irradiated by laser light according to an exemplary embodiment. The VIG unit 1 may comprise two spaced apart substantially parallel glass substrates 2, 3 enclosing an evacuated low pressure space / chamber 6 therebetween. The glass sheets or substrates 2, 3 are interconnected via peripheral edge seals 4, which may be made by using molten solder glass or the like, for example, with reference to the exemplary embodiment, by using a laser 40 as described below. A set of support posts / spacers 5 m...

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Abstract

A method and apparatus for low temperature laser sealing of bonded articles is disclosed. Hermetic sealing of glass substrates using low temperature sealing techniques that do not adversely affect bulk strength of glass substrates, the environment created between the substrates and / or any components housed within the sealed glass substrates is disclosed. Such low temperature sealing techniques include use of localized laser heating of sealing materials to form a hermetic seal between glass substrates that does not involve heating the entire article to be sealed.

Description

technical field [0001] The present disclosure relates to the hermetic sealing of a substrate to form a package, maintain a vacuum, such as a vacuum insulated glass (VIG) window unit, or house heat-sensitive elements, such as photosensitive materials, including organic light-emitting layers, semiconductors, in an inert atmosphere. chips, sensors, optical elements, etc., but not limited thereto. In particular, the present disclosure relates to a technique for hermetically sealing substrates (e.g., glass substrates) using cryogenic sealing without causing damage to the substrates, the environment created between the substrates, and / or the contents contained within the sealed substrates. adverse effect on any component. This cryogenic sealing technique involves the use of localized laser heating of the sealing material to form a hermetic seal between glass substrates without involving heating of the entire article to be sealed. The cryogenic techniques disclosed herein may also ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E06B3/66C03C8/24
CPCE06B3/66C03C8/245H01L2224/83896E06B3/6775E06B3/673H01L2924/1461C03C8/24C03C27/08C03C27/10H01L2924/12044H01L2924/00E06B3/6612E06B3/66333E06B3/66342E06B3/66352E06B3/667E06B3/6733E06B3/67334
Inventor 维贾延·S·维拉萨米马丁·D·布拉卡蒙特
Owner GUARDIAN IND CORP
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