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A kind of pulse tapping microball bouncing device

A bouncing device and pulse technology, which are applied in the field of pulse tapping microball bouncing devices, can solve problems such as inability to meet, and achieve the effect of improving surface quality

Inactive Publication Date: 2017-01-18
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cannot meet the needs of microsphere coatings with high coating surface quality requirements

Method used

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  • A kind of pulse tapping microball bouncing device
  • A kind of pulse tapping microball bouncing device
  • A kind of pulse tapping microball bouncing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] figure 1 It is a front view of the pulse percussion actuator in the pulse percussion microsphere bouncing device of the present invention, figure 2 It is a rear view of the pulse percussion actuator in the pulse percussion microsphere bouncing device of the present invention, image 3 It is a structural schematic diagram of the electromagnetic box in the present invention, Figure 4 It is a structural schematic diagram of the sieve disk assembly under attack in the present invention, Figure 5 for Figure 4 Middle A-A partial top view. exist Figure 1-Figure 5 Among them, the pulse percussion microsphere bouncing device of the present invention contains a pulse percussion generator and a sieve disk assembly; the pulse percussion generator includes a pulse percussion controller and a pulse percussion actuator, and the pulse percussion controller provides The voltage pulse signal with adjustable pulse period is sent to the pulse percussion actuator.

[0029] The pu...

Embodiment 2

[0041] The structure of this embodiment is the same as that of Embodiment 1, except that the mesh size of the sieve is 65% of the diameter of the microspheres, and the diameter of the filaments on the sieve is 25% of the diameter of the microspheres.

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PUM

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Abstract

The invention provides an impulsive knock microsphere bouncing device for uniform coating treatment on the surfaces of microspheres. The device comprises an impulsive knock generator and a knocked screen disk assembly. The core part of the impulsive knock generator is an electromagnetic box consisting of electromagnetic assemblies, series impulsive knock with adjustable knock strength and frequency can be generated to act on the knocked screen disk assembly with the microspheres, and the microspheres periodically and instantly bounce between small grids of a screen disk because of the excitation of the series impulsive knock. According to the impulsive knock microsphere bouncing device, contact and collision between the microspheres and a disk body and between the microspheres are effectively reduced and avoided, the mechanical damage to the surfaces of the microspheres caused by movement is reduced to a low level, and the surface quality of microsphere coatings is greatly improved under the condition of no influence on coating uniformity.

Description

technical field [0001] The invention belongs to the field of film coating preparation, and in particular relates to a pulse-beating microsphere bouncing device, which is used for uniformly coating the surface of the microsphere. Background technique [0002] The surface coating of microspheres has been widely used in the experimental research of inertial confinement fusion. The microsphere bouncing device is a device that makes the microspheres move freely and randomly in the coating environment to achieve a uniform coating on the surface. Its quality is directly related to the quality of the microsphere coating. The microsphere bouncing technology has become the surface coating of microspheres. An important part of layer technology. The Chinese patent (Patent No.: ZL2004200105824.7) named "Horizontal Vibration Microsphere Bounce Device" and the Chinese patent (Patent No.: ZL200920315754.0) named "Sieve Mesh Microsphere Bounce Device" better solve the problem of microsphere...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C13/02
Inventor 黄勇张占文陈素芬刘一杨李波史瑞廷刘梅芳苏琳李洁李婧冯建鸿
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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