Cofired ceramic heating member preparation technology
The invention relates to a technology for a ceramic heating body and a preparation process, which is applied in the field of preparation technology of the heating body, and can solve the problems of reducing the service life of the heating element, uneven heat transfer of the heater, and high cost, so as to accelerate the diffusion of oxygen ions, reduce the production cost, and reduce the production cost. Efficiency-enhancing effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0099] The preparation process of a laminated co-fired ceramic heating body in this embodiment comprises the following process steps:
[0100] a. Mixing: Weigh 65% Si by mass percentage 3 N 4, 10% MgO, 5% Y 2 o 3 , 5% Al 2 o 3 , 5% SiO 2 , 5% La 2 o 3 , 5% BN and mix and stir evenly to make ceramic substrate powder;
[0101] b. Ball milling: add the ceramic substrate powder prepared in step a into grinding balls, solvent and adhesive and put it into a ball mill tank for wet ball milling. The time of wet ball milling is 8 hours;
[0102] c, defoaming: the mixture after wet ball milling in step b is degassed under vacuum conditions;
[0103] d. Forming and drying: cast the mixture in step c into a ceramic substrate with a casting machine or roll it into a ceramic substrate with a film rolling equipment, and dry the ceramic substrate;
[0104] e, printing: the resistance paste is printed on the surface of the ceramic substrate after being dried in step d by the screen p...
Embodiment 2
[0109] The preparation process of a laminated co-fired ceramic heating body in this embodiment comprises the following process steps:
[0110] a. Mixing: Weigh 98% Si by mass percentage 3 N 4 , 0.5% MgO, 0.5% Y 2 o 3 , 0.2% Al 2 o 3 , 0.3% SiO 2 , 0.2% La 2 o 3 , 0.3% BN and mix and stir evenly to make ceramic substrate powder;
[0111] b. Ball milling: add the ceramic substrate powder prepared in step a into grinding balls, solvent and adhesive and put it into a ball mill jar for wet ball milling. The time for wet ball milling is 11 hours;
[0112] c, defoaming: the mixture after wet ball milling in step b is degassed under vacuum conditions;
[0113] d. Forming and drying: cast the mixture in step c into a ceramic substrate with a casting machine or roll it into a ceramic substrate with a film rolling equipment, and dry the ceramic substrate;
[0114] e, printing: the resistance paste is printed on the surface of the ceramic substrate after being dried in step d by...
Embodiment 3
[0119] The preparation process of a laminated co-fired ceramic heating body in this embodiment comprises the following process steps:
[0120] a. Mixing: Weigh 75% Si by mass percentage 3 N 4 , 8% MgO, 4% Y 2 o 3 , 4% Al 2 o 3 , 3% SiO 2 , 3% La 2 o 3 , 3% BN and mix and stir evenly to make ceramic substrate powder;
[0121] b. Ball milling: add the ceramic substrate powder prepared in step a into grinding balls, solvent and adhesive and put it into a ball mill tank for wet ball milling. The time of wet ball milling is 14 hours;
[0122] c, defoaming: the mixture after wet ball milling in step b is degassed under vacuum conditions;
[0123] d. Forming and drying: cast the mixture in step c into a ceramic substrate with a casting machine or roll it into a ceramic substrate with a film rolling equipment, and dry the ceramic substrate;
[0124] e, printing: the resistance paste is printed on the surface of the ceramic substrate after being dried in step d by the screen ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com