FOUP structure and FOUP cleaning method

Abstract

The invention discloses a front-opening-unified-pod (FOUP) structure and an FOUP cleaning method. An air inlet pipe and an air outlet pipe are arranged at inner sides of side plates at two sides an FOUP unit to form a unidirectional air flowing channel; and a plurality of air inlets and air outlets are formed in the air inlet pipe and the air outlet pipe from top to bottom. Therefore, the airflow can be distributed in the longitudinal space uniformly and wafers at the top and bottom of the FOUP unit can be blown; and compared with the prior art, the airflow is stable and uniform. The clean uniformity, the cleaning efficiency, and the cleaning effect of wafers in the FOUP unit can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor related equipment and technology, in particular to a FOUP structure and a FOUP cleaning method. Background technique [0002] With the increasing integration of semiconductor elements in integrated circuits, the relative accuracy of the manufacturing process is extremely important. Because once a slight error or contamination occurs in the manufacturing process, it may cause the failure of the manufacturing process, resulting in damage or scrap of the wafer, thus consuming a lot of cost. [0003] Throughout a semiconductor fabrication facility, multiple wafers are typically transferred and stored in batches by wafer carriers between the load ports of different wafer processing tools or equipment. Such tools typically perform various processes used in IC chip fabrication, such as photolithography, etching, material / film deposition, curing, annealing, inspection, or other processes. One such...

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Problems solved by technology

like figure 1 As shown, there are two air inlets 21 at the bottom of the FOUP, but such a setting will cause the gas fluidity to deteriorate due to the obstruction of the upper wafer during gas purification, thereby deteriorating the purification effect of the FOUP

[0006] The prior art provides another FOUP structure, such as figure 2 As shown, two ventilation pipes 31 are arranged on the rear side of the FOUP, and the air outlet 32 ​​is arranged at the bottom of the FOUP, which will cause the airflow to flow directly to the bottom and be discharged from the air outlet, while the flow rate of the upper wafer is very small, which affects the flow of the upper wafer. Purification effect

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