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Glue dispensing machine and glue dispensing position measuring method

A technology of dispensing position and dispensing machine, which is used in measuring devices, devices for coating liquid on surfaces, instruments, etc., can solve the problems of frequent debugging, long equipment debugging time, and high defect rate, and improve the dispensing uniformity. and continuity, to achieve the effect of dispensing uniformity and continuity

Inactive Publication Date: 2015-09-02
SHENZHEN TINNO WIRELESS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to problems such as long equipment debugging time in production, frequent debugging, and high defect rate.

Method used

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  • Glue dispensing machine and glue dispensing position measuring method
  • Glue dispensing machine and glue dispensing position measuring method
  • Glue dispensing machine and glue dispensing position measuring method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] This embodiment provides a glue dispenser, please refer to figure 1 and 2 , the glue dispensing machine includes a machine base 100 , a driving mechanism, a glue dispensing mechanism 300 , workpiece tables ( 410 , 420 ), a control unit and a height measuring mechanism 500 .

[0046] Wherein, the driving mechanism drives the glue dispensing mechanism 300 and / or the workpiece platform to move, so that the glue dispensing mechanism 300 moves relative to the workpiece platform along X, Y, and Z axes.

[0047] Specifically, the drive mechanism in this embodiment includes an X-axis drive assembly, a Y-axis drive assembly, and a Z-axis drive assembly.

[0048] The X-axis driving assembly and the Z-axis driving assembly are connected with the dispensing mechanism 300 to drive the dispensing mechanism 300 to move along the X and Z axes, and the Y-axis driving assembly is connected to the workpiece table to drive the workpiece table to move along the Y-axis.

[0049] Of course,...

Embodiment 2

[0078] The second embodiment discloses a glue dispenser.

[0079] The difference between this dispensing machine and the dispensing machine disclosed in Embodiment 1 is that the height measuring mechanism on the dispensing machine is not connected to the control unit, and after the height measuring mechanism measures the thickness of the workpiece, it can take prompt methods such as displaying data Prompt, the operator manually enters Z according to the height data measured by the height measuring mechanism 测 Or set Z directly 点 , the control unit drives the dispensing mechanism and / or the movement of the workpiece table to perform dispensing.

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Abstract

The invention discloses a glue dispensing machine and a glue dispensing position measuring method. A height measuring mechanism is mounted on a glue dispensing mechanism of the glue dispensing machine and is used for measuring workpiece thickness, and an operator can set a point Z according to height data measured by the height measuring mechanism without moving the height of a needle manually, so that the problem of discontinuous glue dispensing caused by deformation degree of a to-be-glued workpiece can be solved, and uniformity and continuity in glue dispensing are achieved.

Description

technical field [0001] The application relates to a glue dispensing machine and a method for measuring the glue dispensing position thereof. Background technique [0002] Glue dispensing is a process, also known as sizing, gluing, glue pouring, glue dropping, etc. Specifically, the electronic glue, oil or other liquids are smeared, potted, and dripped on the product, so that the product can play the role of sticking, potting, insulating, fixing, and smoothing the surface. The application range of dispensing is very wide, ranging from large aircraft and ships to small production of clothes and toys, all of which may require dispensing. [0003] In the dispensing process, the height of the tip of the needle from the surface of the workpiece is a very important parameter. In practical applications, the workpiece will be deformed due to manufacturing and other reasons, resulting in uneven gluing surface of the workpiece. When setting the dispensing path, it is necessary to se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10G01B21/00
Inventor 左海涛艾惠健
Owner SHENZHEN TINNO WIRELESS TECH
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