Processing method of electronic equipment housing, housing and electronic equipment

Abstract

The invention discloses an electronic device housing processing method, a housing and an electronic device. The method is applied in the electronic device; the electronic device comprises a housing; the housing comprises a first workpiece, a second workpiece and a sandwich layer. The method comprises the steps of: placing the first workpiece, the second workpiece and the sandwich layer in an enclosed space according to position relations; a first space is left between the first workpiece and the sandwich layer; a second space is left between the sandwich layer and the second workpiece. In a hot press molding process, a first filler and a first auxiliary filler are injected and mixed in the first space and the second space, so as to obtain an integral molding housing after heating and solidification processing in the hot press molding process.

Description

technical field [0001] The invention relates to material processing technology, in particular to a processing method for an electronic equipment casing, the casing and the electronic equipment. Background technique [0002] In the process of implementing the technical solutions of the embodiments of the present application, the inventors of the present application at least found the following technical problems in the prior art: [0003] People have higher and higher requirements for the lightweight of electronic equipment such as tablet computers and mobile phones. Due to the characteristics of high strength and low density, carbon fiber materials are also more and more applied to the shell processing of electronic equipment shells. . [0004] In the flat plate processing of carbon fiber materials, a very characteristic sandwich structure is commonly known as a sandwich structure, such as figure 1 As shown, that is, adding rigid foam to two composite carbon fiber-like mat...

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Problems solved by technology

[0007] Although the above-mentioned treatment process can effectively produce a sandwich structure, how to ensure a good combination of the upper and lower panels made of carbon fiber materials and the sandwich layer has become an important factor in maintaining the rigidity of the system. Moreover, this forming method of the treatment process cannot One-time molding, low production efficiency, and difficult to guarantee quality

In related technologies, there is no effective solution to this problem

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