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Heat radiation mobile phone shell

A mobile phone case and shell technology, applied in the direction of the structure of the telephone, can solve the problems of rapid heating, affecting the performance and comfort of the mobile phone, and insufficient heat transfer speed, so as to improve the heating condition, protect its own performance, and improve the use of The effect of comfort

Inactive Publication Date: 2015-09-09
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that existing mobile phones have insufficient self-heat conversion speed, which will quickly generate heat and affect the performance and comfort of the mobile phone, the present invention designs a new type of mobile phone case that can effectively help the mobile phone to cool down and dissipate heat

Method used

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Embodiment Construction

[0022] The present invention is further described in conjunction with accompanying drawing:

[0023] The structure of the heat dissipation mobile phone shell of the present invention is as follows: figure 1 As shown, the heat-dissipating mobile phone case includes a case 1, and a first hole 11 and a second hole 2 are arranged on the outer upper part of the case. A semiconductor chip 7 and a switch 9 are arranged in the second hole 2 , and a fan 3 , a motor 4 and a switch 10 are arranged in the first hole 11 . A groove 5 is arranged on the lower part of the outer side of the housing, and a battery box 6 is arranged in the groove 5, and a battery 8 is installed in the battery box 6 .

[0024] Such as figure 2 As shown, the semiconductor chip 7 and its adjacent switch 9 are connected in series through wires, then connected in parallel with the series circuit of the fan 3, motor 4 and its adjacent switch 10, and finally connected to the positive and negative poles of the batter...

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Abstract

The invention discloses a heat radiation mobile phone shell, including a shell. An energy source part and a refrigeration part are arranged on an outer surface of the shell, the energy source part includes a battery, the refrigeration part includes a semiconductor refrigeration unit and a fan refrigeration unit which are connected in parallel at two ends of the battery, the semiconductor refrigeration unit includes a switch and a semiconductor refrigeration sheet which is formed by joining an N type semiconductor material and a P type semiconductor material, and the fan refrigeration unit includes a fan, a motor and a switch. Compared with the prior art, a heat radiation method of the heat radiation mobile phone shell effectively relieves heat generation of a mobile phone, thereby preventing damage of the mobile phone battery, reduction of the life of the battery and damage of a CPU due to overtemperature, and improving use comfortableness.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation mobile phone case based on semiconductor refrigeration technology designed to improve the performance and comfort of the mobile phone. Background technique [0002] The emergence of mobile phones has greatly changed people's lives. At present, mobile phones are not limited to simple functions such as making calls and sending text messages. Most mobile phones have more and more complete functions, such as surfing the Internet, playing games, watching videos, listening to music, etc. on mobile phones. However, with the improvement of mobile phone performance, the CPU processing capacity of the mobile phone is getting stronger and stronger, the battery consumption is getting faster and faster, the heat generation of the mobile phone is also increasing, and the demand for heat dissipation is also increasing. If the large amount of heat generated by smartphones when run...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
Inventor 张曼诸葛阳宋璐云
Owner SOUTHEAST UNIV
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