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Dispensing device for liquid film material

A technology of membrane material and liquid state, which is applied to the device and coating of surface coating liquid, which can solve the problems of faster flow rate and shorter heating time of membrane material

Inactive Publication Date: 2018-02-16
SUMITOMO HEAVY IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the flow rate increases, the flow velocity in the piping becomes faster, and the time for the membrane material to be heated in the piping is shortened.

Method used

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  • Dispensing device for liquid film material
  • Dispensing device for liquid film material
  • Dispensing device for liquid film material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] figure 1 A schematic diagram of the dispensing device of the embodiment is shown in . A stage 13 is supported on the base 10 via a moving mechanism 11 . Define the xyz Cartesian coordinate system in which the xy plane is the horizontal plane and the vertical top is the positive direction of the z axis. The stage 13 is movable in the x direction and the y direction. A substrate 15 as an object to be formed of a film is held on the stage 13 . The substrate 15 is, for example, a printed circuit board on which a solder resist film is to be formed, a support substrate serving as a base for forming a thick copper substrate, or the like. The substrate 15 is adsorbed on the stage 13 .

[0025] The nozzle head 20 is supported above the stage 13 via a support plate 21 . The nozzle head 20 turns the liquid film material into droplets and discharges it toward the substrate 15 held on the stage 13 . As a film material, for example, a photocurable resin is used. figure 1 Altho...

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PUM

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Abstract

The invention provides a discharging device of a liquid film material, which can fully heat a film material without lengthening a pipe. A first pot of the discharging device is configured to overflow internal liquid film materials if a liquid level exceeds a certain height. The first pot is internally provided with a heater, and heating flow paths are divided through the side surface of the first port and the heater. A first path supplies liquid film materials to a heating flow path from the lower end of the heating flow path. A nozzle head is provided with a plurality of nozzle holes discharging liquid film materials. A second path conveys film materials overflowing form the first pot to the nozzle head.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2014-047141 filed on March 11, 2014. The entire contents of this Japanese application are incorporated herein by reference. technical field [0002] The present invention relates to a discharge device for discharging a liquid film material from a nozzle hole. Background technique [0003] A technique for forming a film having a predetermined pattern on a substrate surface by discharging droplets of a film material from a nozzle head is known (for example, Patent Document 1). The substrate on which the film should be formed is, for example, a printed circuit board, a thick copper substrate, or the like. The film formed on the printed circuit board is, for example, a solder resist film, and the film formed on the thick copper substrate is, for example, an insulating film disposed between thick copper patterns. [0004] The liquid film material is supplied from the circulation device to the nozzl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/00B05C11/00
CPCB05C5/02B05C9/14
Inventor 西牧润
Owner SUMITOMO HEAVY IND LTD